English
| Part Number: | 338S00316-A1 |
|---|---|
| Manufacturer/Brand: | APPLE |
| Part of Description: | APPLE BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Lead Time | 2-3days after payment. |
| Product Attribute | Attribute Value |
|---|---|
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




338S00316-A1
APPLE
Y-IC is a trusted quality distributor of APPLE brand components. We deliver genuine parts, fast service, and dependable support to ensure you get the best products and experience.
Apple specialized IC in a high-density 869-ball BGA package (BGA-869). Proprietary Apple part number 338S00316-A1. Category: Integrated Circuits (ICs). Classification: Specialized ICs. Designed for Apple device logic boards and high-reliability mobile electronics. RoHS-compliant and compatible with automated SMT assembly. Current available stock: 5400 units (inventory subject to change).
869-ball BGA package for dense, high-pin-count connectivity
Apple-specific, board-level specialized IC
Compact, low-profile package suitable for slim devices
Lead-free construction and RoHS compliance
Designed for automated SMT reflow processes
Built for reliable operation in mobile consumer electronics
Genuine Apple sourcing with Y-IC quality assurance
Stable supply with current stock visibility
Professional inspection and safe packaging for transit
Technical assistance and application guidance from our team
Competitive pricing for volume orders and fast delivery options
Type: Ball Grid Array (BGA-869), surface-mount
Materials: Molded epoxy encapsulation over organic substrate; lead-free SAC alloy solder balls
Ball layout: 869-ball fine-pitch matrix for high I/O density
Size: Low-profile BGA; exact outline per Apple mechanical spec
Pin configuration: Grid array with Apple-proprietary pinout
Assembly: Standard SMT reflow; observe moisture sensitivity and ESD-safe handling
Thermal characteristics: Heat flow depends on PCB copper, thermal vias, and ground planes; design for adequate dissipation
Electrical properties: High-density I/O requiring controlled impedance routing and solid power integrity practices
Status: Proprietary Apple IC tied to specific device generations; supply may vary by production cycle and model demand
Discontinuation: No public end-of-life notice known; availability can be constrained due to Apple platform lifecycle
Equivalents or alternatives: No true drop-in equivalents due to Apple-specific functionality and pinout
For repair alternatives or device-level compatibility advice, please contact our sales team via our website for tailored guidance
Apple smartphones and tablets mainboards
Consumer electronics repair, refurbishment, and EMS rework
Mobile computing platforms within the Apple ecosystem
Board-level maintenance and spare parts for OEM and service centers
Our website offers the most authoritative datasheet and technical resources available for this product model. Download the datasheet on this page to get the latest specifications, handling guidelines, and assembly notes.
Limited Time Offer. Get a Quote on our website for 338S00316-A1 today. Learn More and secure your stock now with Y-IC’s trusted quality, fast shipping, and expert support.
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338S00316-A1APPLE |
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