APPLE 338S00209-A0

Mfr. Part

338S00209-A0

Manufacturer

APPLE. Y-IC is a quality distributor of the APPLE brand and we will provide customers with the best products and services

Detailed Description

APPLE proprietary Specialized IC in high-density BGA package. BGA ball count 869. Designed for integration in Apple hardware platforms. Category Integrated Circuits ICs. Small classification Specialized ICs. Current available quantity 5960 units. Professional sourcing and screening by Y-IC to ensure reliability and consistency

Key Features

Original APPLE specialized integrated circuit

High pin-count BGA 869 for dense interconnects

Lead-free and RoHS compliant supply where applicable

Stable electrical performance tailored for Apple system designs

Tested and stored to industry best practices by Y-IC

Suitable for automated SMT assembly and reflow

Traceability support where available

Key Advantages

OEM-grade quality for precise fit in Apple designs

High integration reduces board space and simplifies routing

Robust mechanical connection with BGA for reliable long-term operation

Lower inductance paths compared to leaded packages improve signal integrity

Y-IC provides dependable supply, fast response, and technical guidance

Stock on hand helps reduce lead time and project risk

Packaging

Type BGA package with 869 balls

Material organic substrate with solder balls typical SAC305 lead-free alloy

Size compact high-density footprint optimized for mobile and consumer designs exact dimensions per datasheet

Pin configuration matrix ball array optimized for power and high-speed signals consult ball map in datasheet

Thermal characteristics BGA aids heat spreading through board copper planes use adequate thermal vias and heat-sinking strategy reflow per lead-free profile

Electrical properties low parasitics from short interconnects stable power distribution through dedicated balls impedance control through proper PCB stack-up details in datasheet

Handling moisture sensitive packaging typical for BGA store sealed and bake if required follow MSL guidance in datasheet

Shipping ESD-safe reels or trays with dry-pack and desiccant exact packing form may vary by lot and should be confirmed at order time

Lifecycle

Status proprietary Apple IC lifecycle tied to specific device generations and may change without public notice

Not known to be nearing discontinuation based on general market availability but official lifecycle data is not publicly released

Direct equivalents are typically not available outside Apple program even if base numbers look similar

If alternatives exist they are usually same base number with different revision suffix or board-specific variants interchangeability is not guaranteed and must be validated against your target device and PCB revision

For cross or replacement options and for confirmed lifecycle status contact our sales team via our website for detailed support and verification

Key Application Areas

Smartphones and tablets within Apple product ecosystems

Consumer electronics modules and logic boards requiring Apple-specific ICs

High-density mobile platforms where compact BGA integration is essential

Service repair and refurbishment of Apple devices

R&D and reverse engineering labs working on Apple-compatible hardware

Datasheet

Our website hosts the most authoritative datasheet and technical documentation available for this product model. We recommend downloading the datasheet directly on the current page for ball map details reflow profile PCB guidelines and full specifications

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