APPLE 338S0026-A1

Mfr. Part

338S0026-A1

Manufacturer

APPLE. Y-IC is a quality distributor of APPLE parts and we will provide you with the best products and services. We follow strict sourcing and testing and deliver fast

Detailed Description

Apple proprietary specialized IC in a high pin count BGA package. Main category Integrated Circuits ICs. Small classification Specialized ICs. Package or case noted as 869 which indicates a very high ball count BGA format. Designed for dense boards and complex Apple system designs. Suitable for OEM build, repair, and refurbishment. Current stock quantity 3790 units available at Y-IC

Key Features

Proprietary Apple specialized IC for Apple platforms

Ball Grid Array BGA package for dense routing and compact footprints

Very high pin count to support complex system interfaces

Supports standard SMT reflow processes with BGA handling

Stable interconnects for high speed signals when laid out correctly

Available through Y-IC with professional quality control

Key Advantages

Small footprint with many connections enabling compact board design

Short interconnect paths in BGA improve signal integrity

Good thermal path through solder balls into the PCB for heat spreading

Compatible with standard BGA rework, reballing, and assembly tools

Y-IC provides reliable supply, screening, and technical support

Packaging

Type Ball Grid Array BGA

Materials Molded plastic over organic substrate commonly used for BGAs

Pin configuration High ball count grid array. The 869 package code points to a very dense array. Confirm exact ball count and map from the datasheet on our site

Body size and ball pitch Exact dimensions depend on revision. Check the datasheet and product page for the latest mechanical drawings

Thermal characteristics Heat is conducted into the PCB through the ball array. Use ground planes, thermal vias, and adequate copper area to improve dissipation

Electrical properties BGA structure reduces lead inductance. Place decoupling capacitors close to the power pins and follow high speed layout rules

Handling and shipping Usually supplied in moisture barrier bag with desiccant and HIC. Follow MSL guidelines and bake if required before reflow. Use ESD protection during handling

Lifecycle

Lifecycle status is not publicly disclosed for Apple proprietary parts

Availability can vary by production cycle and model generation

No confirmed drop in third party equivalents are published for this part

If you need compatible alternatives or cross references please contact the Y-IC sales team via our website for up to date guidance

We can advise suitable replacements and compatibility options after checking current inventory and your target board

Key Application Areas

Apple mobile devices, tablets, notebooks, and accessories that specify 338S0026-A1

OEM production lines and authorized repair operations

Independent repair labs and refurbishment centers performing board level service

High density consumer electronics designs that integrate Apple system ICs

Datasheet

Our website hosts the most authoritative datasheet and technical resources available for this product model. We recommend downloading the datasheet on this page to get the latest specifications, pin maps, and handling guidelines

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