APPLE 338S00217-A1

Mfr. Part

338S00217-A1

Manufacturer

APPLE. Y-IC is a quality distributor for APPLE components and we will provide you with the best products and services, including genuine sourcing, strict quality control, fast delivery, and dedicated support.

Detailed Description

APPLE specialized integrated circuit (IC) in a BGA package. Main Category: Integrated Circuits (ICs). Small Classification: Specialized ICs. Package/Case: 869 (high ball-count BGA). This device is designed for high-density Apple system designs and is commonly used in mobile and consumer electronics platforms. Current available quantity: 2140 units.

Key Features

Specialized APPLE IC for high-integration designs

BGA packaging for compact footprint and dense I/O

High pin count (869 balls) for complex system connectivity

Designed for reliable performance in portable devices

Lead-free, RoHS-compliant manufacturing

Suitable for high-speed, low-power architectures typical of modern consumer devices

Supported by Y-IC’s traceable supply chain and incoming quality inspection

Key Advantages

Optimized for Apple platforms and assemblies

Space-saving BGA for tight PCB layouts

Robust reliability with OEM-grade process standards

Y-IC advantages: genuine parts, strict QC, flexible MOQ, competitive pricing, quick turnaround, and professional technical and logistics support

Reduced time-to-production through ready stock and responsive customer service

Packaging

Type: BGA (Ball Grid Array)

Ball Count: 869 (high-density grid)

Materials: BT/FR-4 laminate substrate and epoxy mold compound; lead-free SAC solder balls (typical for modern BGA)

Size: Compact mobile IC footprint; exact body dimensions, ball pitch, and height are defined in the product datasheet

Pin Configuration: 869-ball array with standardized ball map; orientation/corner markers per Apple/JEDEC norms; consult datasheet for full ball assignment

Handling and Thermal Characteristics: Follow JEDEC J-STD-020 lead-free reflow profile; observe moisture sensitivity level (MSL) and bake-out guidance as specified in the datasheet; provide adequate PCB copper for heat spreading; underfill may be recommended depending on shock/vibration requirements

Electrical Properties: Designed for low-power operation with defined supply rails and I/O standards; power/ground ball distribution for stable performance; integrated ESD protection common to Apple ICs; exact voltage ranges, timing, and interface details are specified in the datasheet

Lifecycle

Status: Lifecycle and availability may depend on the specific Apple device generation and production schedule

Nearing discontinuation: No public EOL notice is available; check current stock and lead times with Y-IC

Equivalents/Alternatives: No public drop-in equivalent is officially documented for 338S00217-A1. For potential compatible revisions or alternatives, please contact our sales team via our website. We will help verify fit, function, and board-level compatibility.

Key Application Areas

Smartphones and tablets within the Apple ecosystem

Portable consumer electronics and media devices

High-density, battery-powered embedded systems

Compact boards requiring large I/O counts and reliable performance

Datasheet

Our website hosts the most authoritative datasheet for 338S00217-A1. We strongly recommend downloading the datasheet on this page to get exact electrical, mechanical, and thermal specifications, pin maps, and handling guidelines.

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