ALPS 338S00429

Mfr. Part

338S00429

Manufacturer

ALPS

Y-IC is a quality distributor of ALPS products. We deliver genuine parts, fast service, and reliable support to help you source the best ALPS components with confidence.

Detailed Description

ALPS 338S00429 is a specialized integrated circuit in a BGA package. It targets high-density designs where space, performance, and reliability are critical. Main Category: Integrated Circuits (ICs). Small Classification: Specialized ICs. This device is often used in advanced consumer and embedded systems. Package/Case code: 869. Date Code: 16+.

Key Features

BGA package for compact, high-pin-count integration

Designed for specialized system functions in modern electronics

High reliability and OEM-grade quality

Optimized for dense PCB layouts and high-speed interconnects

Lead-free, RoHS-compliant manufacturing (typical for ALPS ICs; verify in datasheet)

Supports standard industrial assembly and reflow processes

Stable operation across typical consumer operating conditions

ESD and EMC performance aligned with common industry practices (see datasheet for exact levels)

Key Advantages

Small footprint, enabling compact device designs

High I/O density for complex systems

Strong manufacturing quality and consistency from ALPS

Reduced routing complexity versus QFP/TSOP due to BGA grid

Better thermal and electrical performance potential with proper PCB design

Suitable for volume production with standard SMT lines

Backed by Y-IC’s secure sourcing and responsive customer service

Packaging

Type: BGA (Ball Grid Array)

Material: Molded epoxy encapsulation over BT resin substrate (typical for BGA ICs)

Size: Compact footprint; refer to the datasheet for exact body dimensions and height

Pin configuration: Grid of solder balls; ball pitch and ball count depend on the 869 package version (see datasheet)

Thermal characteristics: Efficient heat spreading with well-designed copper planes and thermal vias; follow recommended reflow profile and board thermal guidelines

Electrical properties: I/O standards, supply rails, and timing parameters are application-specific; consult the datasheet for exact limits and design requirements

Package/Case identifier: 869

Moisture sensitivity: Typical MSL 3 for BGA devices; confirm exact MSL in the datasheet before handling

Lifecycle

Status: Mature product with Date Code 16+, not new production

Discontinuation: No public end-of-life notice available at this time; availability may be limited due to age

Inventory: 3610 units currently listed

Equivalents/Alternatives: No public, pin-to-pin direct equivalents are known due to its specialized nature. If you need a functional replacement or redesign support, please contact our sales team via the Y-IC website. We can recommend viable substitutes from ALPS or other brands based on your electrical, mechanical, and firmware requirements.

Key Application Areas

Smartphones, tablets, and consumer electronics

Wearables and portable devices

Embedded control modules and IoT systems

Imaging, audio, and sensor interface boards

High-density boards in space-constrained products

Specialized OEM designs requiring BGA integration

Datasheet

Y-IC provides the most authoritative datasheet for this model on our website. We recommend downloading it from this page to get exact specifications, pin maps, mechanical drawings, MSL handling, and test limits.

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