APPLE 338S00317-A1

Mfr. Part

338S00317-A1

Manufacturer

APPLE

Y-IC is a quality distributor of the APPLE brand. We supply genuine parts and deliver the best products and services to every customer.

Detailed Description

APPLE proprietary specialized IC in a high-density BGA package

Main Category Integrated Circuits ICs, Small Classification Specialized ICs

Package or case BGA, 869-ball format

Current stock quantity 5100 units available

Intended for Apple platform system boards and professional repairs

Key Features

High integration in compact BGA footprint

869-ball grid array for dense interconnect and high I/O count

Lead-free, RoHS-friendly manufacturing

Designed for automated SMT assembly, reflow compatible

ESD sensitive device, requires proper handling and protection

Supports fine-pitch routing and multilayer PCB designs

Key Advantages

OEM-grade quality and reliability

Space-saving package with many connections for complex designs

Genuine parts supplied by Y-IC with traceability and careful screening

Stable supply, competitive pricing, fast delivery

Global logistics support and responsive customer service

Packaging

Type Ball Grid Array BGA

Ball count 869-ball configuration

Body material epoxy molding compound over silicon die with organic substrate

Ball material lead-free SAC alloy, RoHS friendly

Approximate size not publicly specified; mechanical outline available via datasheet or on request

Ball pitch fine-pitch BGA; exact pitch and ball map are device specific

Pin configuration full grid array; mix of signal, power, and ground balls defined by ball map

Thermal characteristics depend on board design; use thermal vias, solid ground planes, and adequate airflow as required

Reflow guidance follow JEDEC J-STD-020 profiles; ensure proper preheat, soak, peak, and controlled cooling

Moisture sensitivity treat as moisture-sensitive; store in dry pack with desiccant and humidity indicator; follow IPC/JEDEC J-STD-033 for handling and baking

Electrical handling antistatic precautions required; use ESD-safe workstations, wrist straps, and conductive packaging

Lifecycle

Custom Apple component; public lifecycle data is not published

No official end-of-life notice reported by Y-IC at this time

Direct equivalents are uncommon for Apple proprietary ICs and may not be functionally interchangeable

If you need compatible alternatives or cross references, please contact our sales team via our website for detailed assistance and the latest options

Key Application Areas

Apple device mainboard manufacturing and professional repair

OEM and EMS rework, refurbishment, and reverse logistics

High-density embedded systems based on Apple platforms

Authorized service centers and depot repair operations

R&D, education, and failure analysis with proper licensing and compliance

Datasheet

Our website hosts the most authoritative datasheet and technical resources for 338S00317-A1

Download the datasheet on this page to get the mechanical outline, ball map, recommended reflow profile, handling rules, and storage guidelines

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Limited Time Offer 5100 units in stock today. Act now to reserve your lot and lock in availability