English
| Part Number: | 338S00231 |
|---|---|
| Manufacturer/Brand: | APPLE |
| Part of Description: | APPLE BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Lead Time | 2-3days after payment. |
| Product Attribute | Attribute Value |
|---|---|
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




338S00231
APPLE
Y-IC is a quality distributor for APPLE parts. We provide genuine products, competitive pricing, fast delivery, and full service support.
Apple custom Specialized IC in a high ball count BGA package. Main category Integrated Circuits ICs, subcategory Specialized ICs. Package code 869 indicates BGA with a dense ball array. Suitable for integration in Apple hardware platforms. Current available stock at Y-IC 4100 units.
Apple custom silicon Specialized IC
BGA package for compact size and high pin density
869 ball array for robust power and signal distribution
Designed for tight integration in mobile and embedded designs
New and original when supplied by Y-IC with full traceability
Professional quality inspection and handling by Y-IC
High integration saves board space and reduces component count
BGA interconnect supports high speed signals with better integrity
Optimized for Apple systems for stable interoperability
Y-IC secure supply chain helps reduce lead time risk
Direct access to documents and responsive technical sales support
Type BGA ball grid array
Ball count 869
Body size and ball pitch per Apple mechanical drawing for 338S00231
Package materials typical of organic BGA substrate and molding compounds
Pin configuration ball grid layout defined by Apple land pattern for this part
Handling follow the MSL rating on the label and JEDEC moisture control practices
Thermal characteristics depend on board copper area and airflow use heat spreading planes and follow Apple thermal guidance
Electrical properties function specific rails IO levels timing and protections are defined in the official datasheet
Shipping format tray or tape and reel depending on lot contact Y-IC for exact packing details
Lifecycle status is not publicly disclosed by Apple and may vary by production cycle
No known third party drop in equivalents for Apple custom parts
If you require compatible revisions or alternates for 338S00231 please contact Y-IC sales via our website We will check related Apple 338S series revisions and advise on fit form function and availability
Apple smartphones tablets and wearables
Embedded Apple hardware platforms
High density boards requiring many signals and stable power distribution
Aftermarket repair service and refurbishment for Apple products
Our website provides the most authoritative datasheet and technical documents available for this model We recommend downloading the datasheet on this page to confirm pinout mechanical drawings test conditions and application notes
Ready to secure pricing and lead time Get a Quote on our website Learn More about stock and packing options Limited Time Offer priority allocation for qualifying orders Contact Y-IC today for the best products and services
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338S00231APPLE |
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