APPLE 338S00315-A1

Mfr. Part

338S00315-A1

Manufacturer

APPLE

Y-IC is a quality distributor of APPLE components. We deliver genuine parts, competitive pricing, and reliable service to help you get the best products and support.

Detailed Description

Apple proprietary specialized IC in BGA form

Main category Integrated Circuits

Small classification Specialized ICs

Package or case BGA with 869 balls based on the provided data

Revision A1

Description APPLE BGA

Quantity in stock 5300

Designed for Apple system boards and ideal for board-level repair, refurbishment, and maintenance

Key Features

High integration optimized for Apple devices

Space-saving BGA footprint for dense layouts

Ball-grid interconnect for stable electrical and mechanical performance

Lead-free and RoHS compliant in modern builds

Original Apple part number for direct board compatibility

Available from Y-IC with traceable supply and quality screening

Key Advantages

Direct fit for the intended Apple platforms with no redesign

Compact package supports slim and lightweight products

Reliable operation in mobile thermal and mechanical conditions

Backed by Y-IC sourcing assurance, fast shipping, and technical support

Helps repair teams shorten turnaround and cut costs compared to full board replacement

Packaging

Type Ball Grid Array BGA

Ball count 869 balls based on the provided package or case info

Material Molded epoxy over silicon die with lead-free SAC alloy balls typical for PBGA

Pin configuration Ball-grid matrix with device-specific ball functions

Size Compact BGA body outline exact dimensions provided in the datasheet

Mounting Surface-mount reflow following JEDEC J-STD-020 guidance

Moisture handling Store dry and follow MSL guidelines typical BGA parts are often MSL 3 verify in the datasheet

Thermal characteristics Heat spread through PCB copper planes and thermal vias use good layout and adequate copper for heat flow

Electrical properties Voltage rails I O standards and timing are device-specific follow the datasheet for limits and sequencing

ESD handling Use standard ESD protection grounded workstations and proper handling

Inspection X-ray recommended to verify BGA solder joint quality during repair or rework

Lifecycle

Status OEM Apple custom IC lifecycle details are limited outside Apple internal systems

Current supply Not flagged as near discontinuation based on Y-IC inventory and market availability but supply can vary with device production and repair demand

Direct equivalents None Apple 338S-series parts are application-specific and generally not pin-compatible across models

Alternatives Function-level substitutes may exist only within certain Apple board revisions and are not drop-in For cross-reference and alternatives contact our sales team via our website and our engineers will guide you case by case

Key Application Areas

Apple smartphones and tablets logic boards

Apple wearables and other embedded platforms that use this part number

Board-level repair refurbishment and service depots

Stock for maintenance of legacy Apple devices

Technical training R D teardown and diagnostics for Apple hardware

Datasheet

Our website hosts the most authoritative datasheet and technical pack for this model

It includes ball-map mechanical outline recommended reflow profile storage conditions and handling notes

Download the datasheet on this page to ensure correct installation and best performance

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