APPLE 338S00129-A1

Mfr. Part

338S00129-A1

Manufacturer

APPLE. Y-IC is a quality distributor for this brand. We commit to supplying genuine Apple-specified parts and providing customers with the best products and services.

Detailed Description

Apple proprietary Specialized IC in the Integrated Circuits (ICs) category

Package type: BGA, 869-ball array (often referenced as BGA869)

Typical use: Apple mobile device mainboards and modules from the 2016 generation era (Date Code 16+)

Function: Specialized/Apple-specific; exact function and pinout are proprietary to Apple platforms

Ideal for board-level repair, maintenance, and production support where this exact Apple P/N is required

Key Features

High-integration Apple specialized IC for compact, power-efficient mobile designs

Fine-pitch BGA with 869 balls for dense interconnect and high bandwidth

Optimized for low power and thermal performance in handheld devices

Manufactured for Apple’s quality and reliability standards

Compatible only with platforms and firmware designed for this exact part number and revision

Key Advantages

Exact-match Apple P/N for best hardware compatibility on supported boards

Stable supply from Y-IC with professional incoming quality control and handling

Supports rework and repair workflows for Apple device mainboards

Space-saving BGA footprint with high interconnect density

Y-IC offers technical liaison and logistics support to reduce downtime

Packaging

Type: Ball Grid Array (BGA), 869-ball array

Body/Materials: Molded organic substrate with lead-free SAC-type solder balls is typical for this class; confirm per lot

Size: High-density BGA footprint; exact outline and ball pitch are platform-specific and proprietary (refer to datasheet/drawings on our site)

Pin Configuration: Grid array, orientation marker at corner A1; detailed ball map is Apple-proprietary

Tape/Reel/Tray: Supplied on trays or tape-and-reel depending on lot; handling per MSL guidelines

Moisture Sensitivity: Typically MSL 3 for large mobile BGAs; bake and floor-life control recommended (verify per label)

Thermal Characteristics: Designed for board-level heat spreading; underfill or corner-bond may be used per OEM process; follow JEDEC J-STD-020 reflow guidance

Electrical Properties: Digital/mixed-signal specialized IC; supply rails, I/O standards, and sequencing are platform-specific. Use only on the intended Apple design

Lifecycle

Status: Mature part tied to Apple 2016-era platforms (Date Code 16+). Not a general-market component; availability is limited to service, surplus, or authorized distribution channels

Nearing Discontinuation: New production for legacy Apple platforms may be limited; long-term support depends on Apple’s supply chain

Equivalent/Alternative Models: No public drop-in equivalents or second sources exist for 338S00129-A1. Apple parts are not generically interchangeable

Guidance: For compatible revisions, potential suffix variations, or vetted alternates from the same platform, please contact our sales team via the Y-IC website. We will help check board compatibility, date codes, and revision matching

Key Application Areas

Apple smartphone and tablet mainboards from the 2016 generation

Authorized repair centers and advanced rework labs

Refurbishment and maintenance of legacy Apple devices

Contract manufacturers needing exact Apple P/N for production or warranty repair

Failure analysis and engineering validation on Apple platforms

Datasheet

Y-IC provides the most authoritative datasheet and technical documents available for this product model on our website. For mechanical outlines, recommended reflow profiles, ball maps, and handling specs, download the datasheet and related files directly from this product page.

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In stock quantity: 2300 units available now. Act fast for best pricing and allocation.

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