APPLE 338S00047-A1

Mfr. Part

338S00047-A1

Manufacturer

APPLE. Y-IC is a quality distributor of the APPLE brand and we provide customers with the best products and services, including reliable sourcing, fast delivery, and responsive support.

Detailed Description

APPLE 338S00047-A1 is a Specialized IC under the Integrated Circuits category. It comes in a high ball-count BGA package and is designed for Apple platforms. It is typically used on Apple logic boards, with function and connectivity defined by the target device design. Ideal for board-level repair, refurbishment, and exact-fit replacement. Current available quantity is 3172, subject to prior sale.

Key Features

BGA package with 869-ball array for high I/O density

OEM-grade Apple silicon designed for tight system integration

Compact footprint to save board space in mobile and embedded devices

Optimized for high-speed signals and dense interconnect layouts

Compatible with automated BGA placement, reflow, and professional rework

Classified as Specialized ICs within Integrated Circuits

Key Advantages

Direct-fit for assemblies that specify 338S00047-A1

High level of integration reduces component count and PCB complexity

BGA format improves signal integrity and routing efficiency

Supplied by Y-IC with quality inspection, ESD-safe handling, and traceability

Y-IC provides sourcing support, logistics options, and technical guidance

Packaging

Type BGA ball grid array

Package case 869-ball footprint as specified for this device

Materials typical organic BGA substrate with molded encapsulation, exact stack-up per manufacturer drawings

Pin configuration 869 solder balls in matrix layout, ball pitch and map defined by the Apple land pattern. Verify with official documentation

Thermal characteristics depend on PCB copper area and system cooling. Follow proper reflow profiles and consider underfill if required by the assembly spec

Electrical properties such as supply rails, I/O levels, and power dissipation are defined by the device’s role in the target Apple design. Confirm with the datasheet before service or design-in

Shipping packaging ESD-safe trays or similar carrier, sealed in moisture barrier bags with desiccant and MSL labeling for proper handling

Lifecycle

Lifecycle status for Apple custom ICs aligns with the lifecycle of the host Apple products. Public EOL notices are rarely issued

Not known to be near discontinuation at this time, but availability can change quickly based on OEM demand

No direct second-source or public functional equivalents are specified for this Apple part. If you need alternatives for a particular board revision or repair context, please contact our sales team via our website for detailed assistance and cross-review

Key Application Areas

Repair and refurbishment of Apple devices that use 338S00047-A1

Contract manufacturing, rework, and maintenance of Apple-compatible assemblies

Service centers handling smartphones, tablets, and accessories that integrate this IC

Engineering evaluation, diagnostics, and failure analysis for Apple platform hardware

Datasheet

Our website hosts the most authoritative datasheet and technical resources available for this model. Download the datasheet on the current page to confirm pinout, ball map, land pattern, electrical limits, and reflow guidance before use.

Request for Quotation Now

Limited Time Offer. Inventory moves fast. Get a Quote on our website now to secure pricing and availability. Click Learn More to check live stock, access the datasheet, and request samples. Act now to meet your production and repair needs.