APPLE 338S00107-A1

Mfr. Part

338S00107-A1

Manufacturer

APPLE. Y-IC is a quality distributor for APPLE components and we will provide you with the best products and services

Detailed Description

Apple proprietary specialized integrated circuit for use in Apple hardware platforms. Category Integrated Circuits ICs, subcategory Specialized ICs. Typically deployed on Apple device mainboards for OEM production or repair and maintenance. Available stock quantity 1939 units. Date code 15+, indicating production around 2015 or newer batches. Package or case marking 869, Apple internal package code

Key Features

Apple OEM-grade IC, built for high reliability in consumer electronics

Specialized design optimized for Apple system architecture

Stable performance with tight manufacturing tolerances

Lead-free and RoHS compliant manufacturing processes

Consistent lot tracking and traceability

Suitable for professional rework and reflow on multilayer PCBs

ESD and moisture-controlled handling recommended to protect device integrity

Key Advantages

Y-IC supplies genuine, quality Apple components with full support

Competitive pricing and responsive delivery schedules

Professional technical and sourcing support for repair depots and OEMs

Strong inventory position to minimize downtime

Strict incoming inspection and quality assurance to reduce failure risk

Fast order processing and reliable global logistics

Packaging

Type typically tray or tape and reel depending on lot and factory release. Contact us if you need a specific packing format

Material antistatic ESD-safe trays or moisture-barrier bags for tape and reel

Size compact footprint consistent with Apple mobile logic board design. Exact outline per Apple package code 869

Pin configuration commonly fine-pitch BGA or similar array. Ball map and pinout are device-specific and must be verified in the datasheet and board-level documentation

Thermal characteristics optimized for handheld devices. Use proper reflow profile and thermal design practices. Ensure good PCB thermal relief and follow IPC rework guidelines

Electrical properties defined by Apple reference design. Observe voltage rails, sequencing, decoupling, and signal integrity requirements as specified for the target platform. Follow ESD protection and MSL handling. Exact parameters must be confirmed in the datasheet and with your device model

Lifecycle

Apple specialized ICs follow device generation lifecycles. Public end-of-life notices may not be available

This model is not broadly advertised as near discontinuation, but availability can be limited by platform generation

Exact drop-in equivalents are generally not available because Apple parts are custom matched to specific boards

If you seek functional alternatives, compatibility must be validated per device model and logic board revision

For equivalent or alternative options and cross-review, please contact our sales team via our website. We will check stock, revisions, and compatible replacements for your exact application

Key Application Areas

Apple device mainboard repair and refurbishment

OEM manufacturing and service for Apple platforms

Professional repair centers and depot maintenance

Inventory replacement for consumer electronics supply chains

Engineering evaluation and board-level rework with Apple-specific designs

Datasheet

Our website hosts the most authoritative datasheet for this product model. We recommend downloading it from this page to confirm exact specifications, pinout, and handling guidelines

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