APPLE 338S00108

Mfr. Part

338S00108

Manufacturer

APPLE

Y-IC is a quality distributor of APPLE components. We supply genuine parts and deliver the best products and services to every customer.

Detailed Description

Apple specialized IC in a high-density BGA package with an 869-ball array. Designed for Apple system boards and service/repair markets. Fits the Integrated Circuits category and the Specialized ICs subcategory. Built for compact devices with strict power, thermal, and signal integrity requirements. Suitable for SMT reflow and automated production lines. Ideal for OEM-grade repairs and board-level replacements.

Key Features

Specialized Apple IC for platform-specific functions

BGA-869 high-density ball array for compact layouts

OEM-grade reliability and consistency

Supports standard SMT lead-free reflow processes

ESD-sensitive device with handling protections recommended

Designed for high-speed digital interfaces and tight power integrity

Compatible with automated inspection and modern assembly workflows

Key Advantages

Genuine Apple part with traceable supply through Y-IC

Small footprint and low profile for space-constrained designs

Stable performance and robust interconnect via BGA array

Efficient heat spreading through the PCB for better thermal behavior

Lower assembly cost with standard SMT processes

Backed by Y-IC incoming inspection, QC, and customer support

Packaging

Type BGA ball grid array with 869 balls

Materials molded epoxy body, BT resin substrate, lead-free solder balls typically SAC alloy

Size compact low-profile BGA outline, exact dimensions depend on board revision, drawing available on request

Pin configuration 869-ball matrix with fine pitch, ball map is Apple-specific, refer to the datasheet and your board’s design files

Thermal characteristics designed to spread heat into the PCB, observe recommended reflow profile and consider underfill if your assembly spec requires it

Electrical properties optimized for high-speed digital signals and stable power delivery, use controlled-impedance routing and solid decoupling, device is ESD-sensitive

Shipment ESD-safe trays or reels as applicable, moisture barrier bag with desiccant and humidity indicator card, MSL labeling for proper storage and baking when needed

Lifecycle

Status active in service and repair channels with current stock at Y-IC

Not publicly second-sourced because this is a custom Apple IC

No direct equivalent models are officially available

Alternatives may exist across nearby Apple 338S-series revisions depending on device model and logic board version, compatibility must be verified case by case

If you need equivalents or substitutes, contact our sales team via our website for model-by-model guidance and availability

Key Application Areas

Apple smartphones, tablets, and wearable logic boards

Board-level repair, refurbishment, and after-sales maintenance

Consumer electronics using Apple-specific chipsets

Technical labs, diagnostics, and training on Apple hardware

Datasheet

Our website hosts the most authoritative datasheet and technical documents for 338S00108 available to the market. Download the datasheet from this product page to get the mechanical outline, ball map, recommended reflow profile, and handling guidelines.

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