English
| Part Number: | 338S00050 |
|---|---|
| Manufacturer/Brand: | APPLE |
| Part of Description: | APPLE BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Lead Time | 2-3days after payment. |
| Product Attribute | Attribute Value |
|---|---|
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




338S00050
APPLE
Y-IC is a quality distributor of APPLE components and we will provide you with the best products and services
Custom Apple specialized IC in a high pin count BGA package
Main category Integrated Circuits ICs
Small classification Specialized ICs
Package BGA with 869 balls
Description APPLE BGA
Date code 14 plus
Quantity in stock 1963 units
Proprietary Apple device commonly mounted on Apple logic boards
Ideal for repair, rework, and production support of legacy Apple platforms
Apple custom silicon specialized IC
BGA large array 869 interconnect balls
Designed for dense, high reliability integration on Apple system boards
Stable sourcing from Y-IC with inspection and test options on request
Compliance and environmental status can be confirmed on request
Supports professional BGA rework profiles and handling
Reliable supply for legacy Apple hardware needs
Y-IC quality control and traceability when available
Competitive pricing and fast global delivery
Application and handling guidance from experienced support
Flexible order quantities to match project needs
Package type BGA 869-ball array
Shipping form typically tray or ESD safe protective packing
Materials BGA class epoxy mold compound and substrate typical for this device type
Ball alloy lead free SAC type typical for RoHS parts confirmation on request
Pin configuration full matrix style array total 869 connections detailed ball map is Apple proprietary
Size and ball pitch proprietary to Apple request details from our team
Thermal characteristics board level heat spreading required use proper layout and reflow practices detailed values not publicly released
Electrical properties device limits and I O assignments are proprietary request guidance if needed
Moisture sensitivity level to be confirmed handle as a moisture sensitive BGA with proper baking and reflow controls
Legacy Apple custom IC with 14 plus date code indicating earlier generation hardware
Not officially marked end of life but supply can be limited due to OEM lifecycle
No publicly documented one to one generic equivalent
Possible alternates may include later 338S0005x revisions depending on exact device and board compatibility verification required
If you need a direct cross or alternative contact our sales team via the Y-IC website for the latest compatibility options
Repair and refurbishment of Apple smartphones and tablets using this controller
OEM and EMS rework and replacement on Apple logic boards
Failure analysis and engineering labs working with Apple hardware
Advanced BGA rework training and education
Our website hosts the most authoritative available datasheet and technical resources for this model
Download the datasheet on this page to get the latest specifications handling guidelines and application notes
Get a Quote on our website today fast response and competitive pricing
Learn More by contacting our sales team for live stock test reports and logistics support
Limited Time Offer inventory moves quickly secure your allocation now
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338S00050APPLE |
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