English
| Part Number: | 338S00100 |
|---|---|
| Manufacturer/Brand: | Dialog Semiconductor |
| Part of Description: | DIALOG BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Lead Time | 2-3days after payment. |
| Product Attribute | Attribute Value |
|---|---|
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




338S00100
Dialog Semiconductor
Y-IC is a quality distributor of Dialog Semiconductor. We provide original products with reliable sourcing, fast service, and full support to help you get the best results.
Specialized integrated circuit in a BGA package from Dialog Semiconductor. Main Category: Integrated Circuits (ICs). Subcategory: Specialized ICs. Package/Case code: 869. Description: DIALOG BGA. Current available stock: 11,652 units.
Compact BGA package for tight PCB layouts
High integration to reduce component count
Low profile for slim devices
Lead-free, RoHS-compliant construction
Stable electrical connections through ball grid array
Designed for high-volume consumer and mobile electronics
Backed by Dialog’s proven quality and reliability
Saves board space compared to discrete designs
Supports dense routing and high I/O counts
Suitable for automated SMT assembly and reflow
Good thermal spreading through BGA architecture
Lower overall system size and cost in volume
Strong supply support from Y-IC with in-stock units
Type: BGA (Ball Grid Array)
Material: Molded epoxy encapsulation with substrate typical of BGA packages; lead-free solder balls
Size: Dimensions and ball pitch follow Dialog package code “869” (see datasheet for exact measurements)
Pin configuration: Ball-array contacts; ball count and map provided in the datasheet; optimized for standard reflow processes
Thermal characteristics: BGA aids heat spreading; actual performance depends on PCB copper area, thermal vias, and layout; follow datasheet guidelines
Electrical properties: Operating voltages, I/O levels, timing, and current limits are device-specific; refer to datasheet; handle with ESD precautions and use standard lead-free reflow profiles
Lifecycle status may vary by build and market. This model is a specialized IC and drop-in replacements are unlikely due to unique ball maps and platform-specific design.
Equivalent or alternative models (functional alternatives, not pin-compatible; redesign required):
Texas Instruments PMIC families (TPS659xx, TPS65xxx)
NXP PF-series PMICs
Analog Devices/Linear Technology PMICs (ADP-, LTCseries)
Dialog Semiconductor DA90xx/DA91xx families
If you need exact replacement guidance or current lifecycle confirmation, please contact the Y-IC sales team via our website. We will provide up-to-date status and help you evaluate viable substitutes.
Smartphones and tablets
Wearables and other portable consumer devices
Battery-powered embedded systems
Industrial handhelds and IoT endpoints
Space-constrained designs needing integrated control
Y-IC provides the most authoritative datasheet and technical documents for this model on our website. For full electrical specifications, mechanical drawings, ball maps, and application notes, download the datasheet directly on this page.
Get a Quote on Y-IC now to secure pricing and lead time. Learn More and lock in today’s availability. Limited Time Offer: 11,652 units in stock—reserve your allocation immediately.
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338S00100DIALOG |
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