SKHYNIX H9TP33A6ADMCMR-KYM

Mfr. Part

H9TP33A6ADMCMR-KYM

Manufacturer

SK hynix

Y-IC is a quality distributor of SK hynix. We provide genuine products, fast delivery, and professional support to ensure you get the best performance and service.

Detailed Description

High-density embedded memory in a single multi-chip package

eMCP architecture that integrates LPDDR-class DRAM and eMMC NAND flash for mobile and embedded systems

Optimized for compact designs needing high bandwidth RAM and reliable nonvolatile storage

Main Category Integrated Circuits

Small Classification Specialized ICs

Date code 2013+

Package or case code 869

Typical use in smartphones, tablets, handhelds, and compact embedded boards

Current available quantity 2456 units at Y-IC

Key Features

Integrated DRAM plus NAND flash in one compact package

Mobile LPDDR interface with high bandwidth and low power

eMMC standard-compliant managed flash for simple storage design

JEDEC-compliant signaling and timing

PoP friendly for stacking with application processors

RoHS compliant and lead-free manufacturing

Key Advantages

Saves board space by combining RAM and storage

Reduces BOM count and simplifies routing

Low power operation for battery-powered devices

Shortens design time with proven, widely used memory standards

Improves reliability by reducing interconnects

Streamlined supply and qualification through a single part

Packaging

Type eMCP in BGA form factor, typically used in PoP stacks

Material molded epoxy package with lead-free solder balls, RoHS compliant

Size compact mobile footprint; consult datasheet for exact X by Y by Z mm dimensions

Pin configuration ball grid array with separate DRAM and eMMC interfaces; exact ball count and map in datasheet

Ball pitch fine-pitch suitable for mobile designs; refer to datasheet for exact pitch

Thermal characteristics standard mobile-grade operation; verify exact operating and storage temperature ranges in datasheet

Electrical properties multi-rail supply typical of LPDDR and eMMC systems; DRAM rails commonly around 1.2 V; eMMC core/interface commonly 1.8 V and 3.3 V; exact voltages, timings, and speeds in datasheet

Package or case code 869 as provided by source

Lifecycle

Introduced circa 2013 and may be NRND or EOL depending on specific density and revision

Availability is limited and lifecycle status can vary by lot and capacity

Equivalent or alternative families to consider

- SK hynix H9TPxx eMCP family with matching LPDDR and eMMC specs

- Samsung eMCP KLMxGxWE and KLMAGxGE series with LPDDR2 or LPDDR3 plus eMMC

- Micron eMCP MT29TExxxxx series combining LPDDR and eMMC

- Kioxia Toshiba eMCP THGBMxxxxxx series

- Western Digital SanDisk iNAND MCP solutions

Exact drop-in equivalence depends on DRAM density, eMMC capacity and version, pinout, and mechanicals; verify against the datasheet

If you need precise cross references or confirmed replacements, contact Y-IC via our website. Our sales team will match capacity, interface, and package to your design constraints

Key Application Areas

Smartphones and tablets

Wearables and handheld terminals

Portable medical devices

Embedded Linux and Android boards

Industrial handhelds and scanners

IoT gateways and compact edge devices

Automotive infotainment submodules and telematics

Smart cameras and AR VR devices

Datasheet

Our website hosts the most authoritative datasheet for H9TP33A6ADMCMR-KYM. Download it from this page to get exact electrical, mechanical, and interface details. Always verify your design against the official datasheet.

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