HYNIX H9TP65A8JDMCPR-KGM

Mfr. Part

H9TP65A8JDMCPR-KGM

Manufacturer

SK Hynix

Y-IC is a quality distributor of SK Hynix. We provide original parts, quick delivery, and best-in-class support to ensure you get the right product and service.

Detailed Description

SK Hynix H9TP65A8JDMCPR-KGM is an embedded multi chip memory module eMCP that combines mobile DRAM and managed NAND eMMC in one package

Designed to save space and power in mobile and portable designs

Main category Integrated Circuits ICs and sub category Specialized ICs

Data code 14 plus indicates 2014 or later production lot

Package and case code referenced as 869 in the Y-IC catalog

Key Features

DRAM and eMMC storage integrated in a single compact BGA

High bandwidth low power mobile DRAM interface LPDDR class

eMMC managed NAND simplifies storage control and software

JEDEC compliant interfaces for broad compatibility

Lead free and RoHS compliant manufacturing

Fine pitch BGA for dense layouts in small devices

Key Advantages

Smaller PCB footprint and lower device height

Fewer parts to source and assemble reduces BOM and risk

Cleaner layout and better signal integrity between memory dies

Faster design cycles and quicker time to market

Mature ecosystem and proven field reliability

One package simplifies manufacturing and inventory

Packaging

Type fine pitch FBGA eMCP

Case code 869 per Y-IC catalog reference

Material epoxy mold compound with copper substrate and lead free solder balls SAC

Size compact square BGA typically in the 10 to 14 mm range exact outline depends on density and revision verify with datasheet

Pin configuration standardized eMCP ball map with separate DRAM and eMMC signal groups consult datasheet for exact ball count and mapping

Thermal characteristics typical operating range from 0 to 85 C with options for minus 40 to 85 C check suffix and datasheet

Moisture sensitivity level commonly MSL 3 handle with dry pack and follow reflow guidelines

Electrical properties typical mobile DRAM rails around 1.2 V core and 1.8 V I O and eMMC rails 3.3 V or 1.8 V selectable confirm exact voltages and timings in datasheet

Lifecycle

Mature product family with production starting around 2014 actual status varies by revision and density

Current lifecycle status not publicly confirmed for this exact code

Alternative models within SK Hynix H9TP family to consider for capacity or speed alignment examples H9TP32A4GDBCPR KGM H9TP53A8JMMCPR KGM H9TP65A8JDACPR KGM verify details

Cross brand options with similar eMCP functionality include Samsung KLM series Micron MT29T series Kioxia Toshiba THGBM series and offerings from Nanya or Winbond confirm pinout and software compatibility

For verified drop in replacements or lifecycle confirmation contact our sales team through the Y-IC website for expert guidance

Key Application Areas

Smartphones and feature phones

Tablets and handheld POS or scanners

Wearables and smart home controllers

Portable navigation and infotainment devices

IoT modules and gateways

Digital cameras and camcorders

Industrial handhelds and medical portable equipment

Datasheet

Y-IC provides the most authoritative datasheet and technical pack for H9TP65A8JDMCPR KGM

Download the datasheet from this product page to get exact pinout electrical limits timing and package details

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