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Time: June 12th, 2026
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The IR2110 is a high-voltage, high-speed gate driver IC designed to control power MOSFETs and IGBTs. It has independent high-side and low-side output channels, allowing it to drive switching devices with accurate and reliable gate control.
The IR2110 uses rugged CMOS technology, supports standard CMOS and LSTTL logic inputs, and includes a high-pulse-current buffer stage to improve switching performance. Its floating high-side channel can operate up to 500 V, making it suitable for demanding high-voltage circuit designs.
If you are interested in purchasing the IR2110, feel free to contact us for pricing and availability.
|
Parameter |
Specification |
|
Driver Type |
High-Voltage,
High-Speed MOSFET and IGBT Driver |
|
Number of
Channels |
Independent
High-Side and Low-Side Drivers |
|
Floating Channel
Voltage |
Up to 500 V |
|
Process
Technology |
HVIC and
Latch-Immune CMOS |
|
Logic Input Type |
CMOS and LSTTL
Compatible |
|
Floating Channel
Design |
Designed for
Bootstrap Operation |
|
Gate Drive
Supply Range (VCC) |
10 V to 20 V |
|
VDD Range |
5 V to 20 V |
|
Peak Output
Current (Source) |
2 A Typical |
|
Peak Output
Current (Sink) |
2 A Typical |
|
Undervoltage
Lockout (UVLO) |
Available on
Both Channels |
|
dV/dt Immunity |
High Noise
Immunity |
|
Negative
Transient Voltage |
Tolerant |
|
Input Type |
CMOS Schmitt
Trigger with Pull-Down |
|
Shutdown
Function |
Cycle-by-Cycle
Edge-Triggered Shutdown Logic |
|
Delay Matching |
Matched
Propagation Delay Between Channels |
|
Output
Relationship |
Outputs in Phase
with Inputs |
|
Logic and Power
Ground Offset |
±5 V |
|
High-Speed
Operation |
Optimized for
Fast Switching Applications |
|
Available
Packages |
14-Pin DIP,
16-Pin SOIC |

|
Pin
No. |
Pin
Name |
Type |
Function |
|
1 |
LO |
Output |
Low-side gate
driver output. Provides the gate drive signal for the low-side MOSFET or
IGBT. |
|
2 |
COM |
Ground |
Low-side return
path and power ground reference for the driver output stage. |
|
3 |
VCC |
Power Supply |
Supply voltage
for the low-side gate driver output stage. Typically 10 V to 20 V. |
|
4 |
NC |
No Connection |
Internal
connection not used. Leave unconnected unless specified by the manufacturer. |
|
5 |
VS |
Floating Return |
Return reference
for the high-side driver. Connected to the source of the high-side MOSFET or
emitter of the high-side IGBT. |
|
6 |
VB |
Floating Supply |
Floating power
supply input for the high-side driver. Usually connected to a bootstrap
capacitor. |
|
7 |
HO |
Output |
High-side gate
driver output. Drives the gate of the high-side MOSFET or IGBT. |
|
8 |
VDD |
Logic Supply |
Logic circuit
supply voltage. Supports logic input stages and internal control circuitry. |
|
9 |
HIN |
Input |
Logic input
controlling the high-side output (HO). A high input turns on the high-side
driver. |
|
10 |
SD |
Input |
Shutdown control
input. Used to disable both driver outputs for fault protection or system
control. |
|
11 |
LIN |
Input |
Logic input
controlling the low-side output (LO). A high input turns on the low-side
driver. |
|
12 |
VSS |
Logic Ground |
Ground reference
for the logic supply and control inputs. |
|
13 |
NC |
No Connection |
Internal
connection not used. Leave unconnected unless specified by the manufacturer. |
|
14 |
NC |
No Connection |
Internal
connection not used. Leave unconnected unless specified by the manufacturer. |
The IR2110 contains separate high-side and low-side gate-driver sections designed to control power MOSFETs or IGBTs in switching applications. Inside the device, the input signals pass through Schmitt-trigger circuits that improve noise immunity and ensure reliable operation in electrically noisy environments. Internal logic circuits process the control signals and manage the operation of both driver channels.

A key part of the architecture is the high-voltage level-shifting circuit. This block transfers control information from the low-voltage logic section to the floating high-side driver section, allowing the device to operate in applications where the switching node moves over a wide voltage range. The floating driver is powered through the VB and VS terminals, enabling proper gate control of the upper switching device.
The IR2110 also incorporates several protection and timing functions. Undervoltage lockout (UVLO) continuously monitors the driver supply voltages and disables the outputs if the voltage falls below a safe operating level. Pulse filtering helps reject unwanted noise pulses, while the shutdown function provides a convenient method for disabling both driver channels during fault conditions or system protection events.
The IR2110 is widely used in half-bridge, full-bridge, and high-power switching circuits. A common application consists of two N-channel MOSFETs connected in a half-bridge arrangement, allowing efficient control of power delivered to a load. This configuration is frequently found in motor drives, DC-AC inverters, switch-mode power supplies, UPS systems, and induction heating equipment.

A bootstrap diode and capacitor are typically used to generate the floating supply required by the high-side driver. During operation, the capacitor stores energy and provides the voltage needed to turn on the upper MOSFET. This approach eliminates the need for a separate isolated power source for the high-side gate driver, reducing circuit complexity and cost.
Additional external components are commonly included to improve performance. Gate resistors help control switching speed and reduce voltage ringing, while pull-down resistors ensure the power transistors remain in a defined off-state when no control signal is present. These components contribute to stable and reliable switching operation.
Successful IR2110 designs begin with proper PCB layout and power-supply decoupling. Bypass capacitors should be placed close to the VCC-COM and VDD-VSS pins to reduce voltage dips during fast switching. Gate-drive traces should be short and direct to minimize parasitic inductance, while high-voltage and low-voltage sections should have proper spacing for safety and signal stability.

Gate resistor selection is also important because it controls the MOSFET or IGBT switching speed. A smaller gate resistor gives faster switching but may increase ringing and electromagnetic interference. A larger gate resistor slows the switching edge and can reduce noise, but it may increase switching losses.
The circuit must include proper dead-time control between the high-side and low-side devices. This prevents both switches from turning on at the same time, which can cause shoot-through current and damage the power stage.
For better reliability, you should apply noise reduction techniques such as short ground paths, solid COM connection, proper decoupling, and careful routing of HIN and LIN signals away from noisy switching nodes. Protection recommendations include using undervoltage lockout properly, adding suitable gate resistors, checking bootstrap capacitor size, and protecting the MOSFETs or IGBTs from overcurrent, overvoltage, and overheating.
|
Feature |
IR2110 |
IR2101 |
IR2104 |
|
Driver Type |
High-Side and
Low-Side Driver |
High-Side and
Low-Side Driver |
High-Side and
Low-Side Driver with Internal Dead Time |
|
High-Side
Floating Supply Voltage |
Up to 500 V |
Up to 600 V |
Up to 600 V |
|
Output Channels |
Independent
High-Side and Low-Side Outputs |
Independent
High-Side and Low-Side Outputs |
Complementary
High-Side and Low-Side Outputs |
|
Peak Output
Current (Source) |
2 A |
130 mA |
210 mA |
|
Peak Output
Current (Sink) |
2 A |
270 mA |
360 mA |
|
Logic Supply
Voltage (VDD) |
5 V to 20 V |
Not Required |
Not Required |
|
Driver Supply
Voltage (VCC) |
10 V to 20 V |
10 V to 20 V |
10 V to 20 V |
|
Logic Input Pins |
HIN, LIN, SD |
HIN, LIN |
IN, SD |
|
Shutdown Pin |
Yes |
No |
Yes |
|
Undervoltage
Lockout (UVLO) |
High-Side and
Low-Side |
High-Side and
Low-Side |
High-Side and
Low-Side |
|
Level Shifter |
Yes |
Yes |
Yes |
|
Bootstrap
Operation |
Yes |
Yes |
Yes |
|
Matched
Propagation Delay |
Yes |
No |
No |
|
Internal Dead
Time |
No |
No |
Yes |
|
Dead-Time
Control |
External |
External |
Internal |
|
Independent
Control of Both Outputs |
Yes |
Yes |
No |
|
Output Logic
Configuration |
Independent |
Independent |
Complementary |
|
Noise Immunity |
High |
High |
High |
|
MOSFET
Compatibility |
N-Channel
MOSFETs |
N-Channel
MOSFETs |
N-Channel
MOSFETs |
|
IGBT
Compatibility |
Yes |
Limited Drive
Capability |
Limited Drive
Capability |
|
Switching
Frequency Capability |
High |
Moderate |
Moderate |
|
Gate Drive
Strength |
High |
Low |
Medium |
|
External
Components Required |
Moderate |
Low |
Low |
|
Design
Complexity |
Moderate |
Simple |
Very Simple |
|
Package Options |
DIP, SOIC |
DIP, SOIC |
DIP, SOIC |
The IR2110 is designed for high-speed switching and can be used in applications such as inverters, motor drives, and switch-mode power supplies. Before selecting the device, you should evaluate the intended switching frequency and ensure that the MOSFETs or IGBTs can be driven efficiently at that speed. Higher switching frequencies may improve system performance and reduce the size of magnetic components, but they also increase switching losses and heat generation.
The IR2110 can drive both N-channel MOSFETs and IGBTs, but the gate-drive requirements of these devices can differ significantly. MOSFETs are generally preferred for high-frequency operation because of their faster switching speed, while IGBTs are often used in higher-voltage and higher-current applications. The selected power device should be compatible with the IR2110's gate-drive voltage and output current capability.
The IR2110 supports standard CMOS and LSTTL logic levels, making it compatible with many microcontrollers, DSPs, and PWM controllers. You should verify that the logic output voltage of the control circuit meets the input requirements of the driver to ensure reliable switching and proper signal recognition.
Proper supply voltages are essential for reliable operation. The IR2110 typically requires a gate-drive supply voltage between 10 V and 20 V, while the high-side driver uses a bootstrap circuit to generate its floating supply. Adequate bypass capacitors and a correctly sized bootstrap capacitor should be included to maintain stable operation during switching.
The IR2110 uses a level-shifting architecture rather than galvanic isolation. For many half-bridge and full-bridge designs, this approach is sufficient and helps reduce circuit complexity. However, applications that require safety isolation, high common-mode noise immunity, or isolated control systems may require an isolated gate driver instead of the IR2110. Evaluating isolation requirements early in the design process helps ensure compliance with system safety and performance requirements.
• IR2113
• IRS2110
• IRS2113
• IR2101
• IR2104
• IRS2184
• FAN7392
• UCC27714

The IR2110 from Infineon Technologies combines high-side and low-side gate driving, strong output current capability, bootstrap operation, and useful protection features in a single IC. These features help simplify power circuit design while providing reliable control of MOSFETs and IGBTs in high-voltage switching applications. With its independent driver channels, level-shifting architecture, and support for high-speed switching, the IR2110 remains a popular choice for engineers designing inverters, motor drives, power supplies, and other power electronic systems.
The bootstrap capacitor should store enough charge to keep the high-side MOSFET fully enhanced during the entire switching cycle. The value depends on the MOSFET gate charge, switching frequency, leakage currents, and desired voltage margin.
Yes. The IR2110 can drive multiple MOSFETs connected in parallel, provided the total gate charge remains within the driver's capability and proper gate resistors are used for each MOSFET.
A common cause is an improperly charged bootstrap capacitor. Incorrect bootstrap diode selection, insufficient duty cycle, or wiring errors can also prevent the high-side driver from operating correctly.
Without sufficient dead time, both switches may conduct simultaneously, causing shoot-through current. This can lead to excessive heating, reduced efficiency, and possible damage to the MOSFETs and driver circuit.
In some cases, yes, but logic-level compatibility should be verified. If the logic signal is not sufficient for reliable operation, a level-shifting circuit may be required.
Smaller gate resistors increase switching speed but may create more ringing and EMI. Larger resistors reduce noise and switching stress but can increase switching losses.
The practical limit depends on the MOSFET gate charge, PCB layout, gate resistor values, and power-stage design. Many designs operate successfully from tens of kilohertz to several hundred kilohertz.
An isolated gate driver is often preferred when safety isolation, high common-mode noise immunity, or separate control and power grounds are required by the application.
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