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| Part Number: | H9TP32A8JDACPR-KGM |
|---|---|
| Manufacturer/Brand: | HYNIX |
| Part of Description: | HYNIX BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Data Code | 14+ |
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Product Attribute | Attribute Value |
|---|---|
| Lead Time | 2-3days after payment. |
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




H9TP32A8JDACPR-KGM
HYNIX (SK hynix). Y-IC is a quality distributor for SK hynix and we are committed to supplying genuine products with expert support, fast delivery, and reliable after-sales service
H9TP32A8JDACPR-KGM is a SK hynix specialized integrated circuit widely used as a memory multi‑chip solution in embedded systems. Parts in the H9TP series typically integrate managed NAND storage and low‑power DRAM in a single compact BGA package, helping designers save board space, reduce BOM complexity, and simplify memory interfacing. This device is suited to high‑volume consumer, mobile, and IoT applications that need dense, power‑efficient memory with proven reliability
High integration to reduce PCB footprint and simplify routing
Managed NAND plus low‑power DRAM architecture in one package for streamlined system design
Low power operation optimized for battery‑powered devices
JEDEC‑compliant interfaces and standard ball‑map conventions for easier design‑in and second‑source planning
RoHS compliant and lead‑free construction
Production date code available 14+ for traceability and quality control
Fewer components on the board and shorter design cycles
Lower total power versus discrete memory combinations of similar capacity
Proven SK hynix supply chain and quality, improving long‑term product stability
Simplified procurement and inventory management through one qualified part
Broad ecosystem support across mobile and embedded platforms
Device package type BGA multi‑chip package, lead‑free and RoHS compliant
Shipping format typically Tape and Reel or Tray with dry‑pack sealing, desiccant, and humidity indicator card
Moisture sensitivity level per label and datasheet handling guidelines
Pin configuration ball grid array with standardized ball pitch and ball‑map per the official SK hynix datasheet for H9TP32A8JDACPR‑KGM
Thermal characteristics defined in the datasheet including recommended reflow profile and junction‑to‑ambient guidance for typical mobile assemblies
Electrical properties including supply rails and I/O levels defined by SK hynix for this H9TP series device. Refer to the datasheet for operating voltage ranges, timing, and power profiles
Package or case reference 869 as provided, confirm detailed outline drawing and dimensions in the downloadable datasheet or with our sales engineers
Market status mature. Similar H9TP family devices are widely deployed in legacy and current embedded platforms
Nearing discontinuation unknown for this exact suffix. Availability can vary by lot and date code. We currently list in‑stock quantity 1228 with date code 14+
Direct drop‑in equivalents depend on the exact density, speed grade, eMMC revision, LPDDR generation, and ball‑map of your target design. Because these parameters are suffix‑specific, we cannot guarantee form‑fit‑function substitutes without a BOM review
If you require alternatives or second sources, contact Y‑IC via our website. Our team can cross‑reference compatible SK hynix H9TP series options and evaluate potential cross‑brands based on your schematic, PCB land pattern, and firmware constraints
Smartphones and tablets requiring compact memory subsystems
Wearables, handhelds, and battery‑powered embedded devices
Consumer electronics such as smart cameras, media players, and home hubs
Industrial handheld terminals, POS, barcode scanners, and portable data loggers
IoT gateways, modules, and developer platforms where board space is limited
The most authoritative and up‑to‑date datasheet for H9TP32A8JDACPR‑KGM is available on our website. We strongly recommend downloading it from this product page to obtain exact pinout, package outline, electrical limits, timing specifications, and handling guidelines
Get a Quote now on Y‑IC’s website for H9TP32A8JDACPR‑KGM. Secure your inventory from a trusted source and lock in competitive pricing. Limited Time Offer and fast fulfillment available. Click Learn More on the product page or submit your RFQ today to receive priority support and the best available lead time
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