SKHYNIX H9TP32A4GDMCPR

Mfr. Part

H9TP32A4GDMCPR

Manufacturer

SK hynix. Y-IC is a quality distributor for SK hynix and we will provide you with the best products and services.

Detailed Description

SK hynix H9TP32A4GDMCPR is an integrated memory Multi-Chip Package (MCP) used in mobile and embedded designs. It combines high-speed mobile DRAM with non-volatile memory in one compact BGA package to save board space, lower power, and simplify routing. Category: Integrated Circuits (ICs). Subcategory: Specialized ICs. Package/Case code: 869. Date code: 12+. Available quantity: 2210 (subject to change).

Key Features

Integrated mobile DRAM + non-volatile memory (MCP) in one device

Compact fine-pitch BGA footprint for space-constrained designs

Low power for battery-operated products

High bandwidth memory interface for responsive performance

JEDEC-compliant mobile memory standards

Lead-free, RoHS-compliant construction

Stable supply and proven reliability for high-volume manufacturing

Key Advantages

Saves PCB area compared to using separate DRAM and NAND/eMMC chips

Simplifies signal routing and layout, reducing design complexity

Shortens time to market with a single qualified memory solution

Reduces BOM count and procurement overhead

Improves system reliability with matched, co-packaged memory dies

Ideal for slim, thermally constrained handheld devices

Packaging

Type: Multi-Chip Package (MCP), fine-pitch Ball Grid Array (BGA); commonly used in PoP stacks with application processors

Material: Molded epoxy over memory dies, lead-free spheres; RoHS compliant

Size: Ultra-compact square footprint designed for mobile platforms (see mechanical drawing in datasheet for exact dimensions)

Pin configuration: High-density BGA ball map optimized for mobile DRAM and NAND/eMMC interfaces (ball map details in datasheet)

Thermal characteristics: Designed for mobile operating ranges; typical ambient/junction profiles suitable for handhelds (refer to datasheet for allowable temperature ranges and derating)

Electrical properties: Mobile DRAM core/I/O supply rails; eMMC/NAND supply rails for core and I/O per JEDEC (exact voltages, speed grades, and timing parameters in datasheet)

Internal reference: Package/Case code 869

Lifecycle

Status: Legacy mobile memory part with 12+ date code; availability may be limited and it may be approaching end-of-life

Drop-in equivalents: No publicly confirmed 1:1 drop-in replacements due to specific ball map, speed grade, and firmware requirements

Alternatives: Matching parts exist within SK hynix, Samsung, Micron, and Kioxia MCP families, but exact substitution must match density, interface (LPDDR/eMMC), package, and ball map

Next step: Contact our sales team via the Y-IC website to review your requirements. We will propose compatible, current-production alternatives and provide cross-reference guidance

Key Application Areas

Smartphones and feature phones

Tablets and e-readers

Wearables and smart consumer devices

IoT gateways and embedded modules

Portable industrial handhelds and scanners

Entry infotainment and navigation systems (legacy platforms)

Datasheet

Y-IC hosts the most authoritative datasheet for H9TP32A4GDMCPR. For accurate electrical, timing, and mechanical details, download the datasheet from this product page now.

Request for Quotation Now

Get a Quote on Y-IC today. Limited Time Offer—secure your allocation from current stock. Learn More and submit your RFQ on our website for best pricing and fast delivery.