SKHYNIX H9TP65A8JDACPRKGM

Mfr. Part

H9TP65A8JDACPRKGM

Manufacturer

SK hynix (SKHYNIX). Y-IC is a quality distributor for SK hynix. We deliver genuine parts, fast logistics, and dependable technical support to give you the best products and services.

Detailed Description

Device type: Integrated Circuits (ICs) > Specialized ICs

Product class: Mobile memory multi‑chip package (eMCP) that combines DRAM and eMMC NAND in one compact BGA

Purpose: Save PCB space, simplify memory design, and speed qualification in mobile and embedded systems

Inventory status: 2260 units available

Package or case code: 869

Date code: 1509+

Key Features

All‑in‑one memory subsystem with DRAM plus managed NAND (eMMC controller inside)

JEDEC standards compliance for DRAM and eMMC interfaces

Low power modes for extended battery life

High data bandwidth on DRAM interface and high‑speed eMMC

Compact BGA footprint for space‑constrained designs

RoHS compliant and halogen‑free materials

Typical eMMC features such as boot partitions, enhanced/GP partitions, secure erase and wear leveling

Key Advantages

Cuts PCB area and simplifies routing

Reduces component count and BOM complexity

Improves reliability through short internal interconnects

Accelerates time to market with a pre‑validated memory solution

Single part number simplifies sourcing and lifecycle control

Packaging

Type: Fine‑pitch BGA multi‑chip package optimized for mobile/embedded

Materials: Epoxy mold compound and copper substrate, lead‑free, RoHS compliant, halogen‑free

Size: Thin, compact mobile‑grade outline; see datasheet for exact dimensions and thickness

Pin configuration: Ball‑grid array with defined power domains for DRAM and eMMC; ball map per JEDEC. Refer to datasheet for ball count and assignments

Thermal characteristics: Low self‑heating; thermal resistance depends on board design. Follow good layout practice with copper planes and thermal vias. Reference JEDEC thermal measurement methods in the datasheet

Electrical properties: Low‑voltage operation typical of mobile memory. LPDDR‑class rails commonly around 1.2 V core with 1.2/1.8 V I/O. eMMC commonly uses 3.3 V VCC with 1.8/3.3 V VCCQ depending on speed mode. Use the product datasheet for exact limits and timing

Moisture sensitivity: BGA memory is typically MSL 3. Confirm exact MSL on the product label and datasheet. Handle per J‑STD‑020 reflow guidance

Shipping: ESD‑safe trays or tape‑and‑reel depending on order. Package or case code 869 as listed

Lifecycle

Status: Lifecycle can vary by density and speed grade. No public EOL notice is indicated for this specific code at the time of writing. Confirm with Y-IC sales for the latest status

Nearing discontinuation: Not indicated currently. Monitor SK hynix PCN/EOL announcements

Equivalent or alternative models: Exact alternates depend on DRAM density, eMMC capacity, speed grade, and ball map. Because these details are configuration‑specific, please contact our sales team on the Y-IC website for a precise, compatible cross list and second‑source options

Date code note: Current stock shows 1509+. Ask us if you need newer date codes

Key Application Areas

Smartphones and feature phones

Tablets and e‑readers

Wearables and portable consumer devices

IoT nodes and smart home hubs

Industrial handhelds, POS terminals, barcode scanners

Embedded modules, SBCs, and gateways

Automotive infotainment and telematics when qualified

Datasheet

The most authoritative and up‑to‑date datasheet for H9TP65A8JDACPRKGM is available on our Y-IC product page. We recommend downloading it from this page to get the official SK hynix specifications, ball map, timing, and handling guidance.

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