English
| Part Number: | H9TQ17A8GTMC-URKUM |
|---|---|
| Manufacturer/Brand: | SKHYNIX |
| Part of Description: | SKHYNIX BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Data Code | 15+ |
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Product Attribute | Attribute Value |
|---|---|
| Lead Time | 2-3days after payment. |
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




H9TQ17A8GTMC-URKUM
SK hynix. Y-IC is a quality distributor of SK hynix and we will provide you with the best products and services
High-performance mobile DRAM memory IC from SK hynix for embedded and portable devices. Designed for low power operation and high bandwidth in space‑constrained designs. Suitable for OEM and high-volume production. Current available stock 2100 units. Date code 15+
Low-power mobile DRAM architecture for longer battery life
High data bandwidth for fast system performance
Compact footprint for tight layouts
Robust reliability from a tier-one memory manufacturer
RoHS and REACH compliant materials
Broad ecosystem and tooling support
Energy efficient for mobile and IoT designs
Small size enables slimmer devices
Proven quality and stability from SK hynix
Supported by Y-IC with fast delivery and responsive service
Scalable to different performance bins depending on project needs
Type Fine-pitch BGA mobile memory package
Material Lead-free, halogen-free molding compound and lead-free solder balls
Size Compact BGA footprint optimized for mobile boards. Refer to the datasheet for exact dimensions and height
Pin configuration High-density multi-row ball grid. Ball map and signal assignment available in the datasheet
Thermal characteristics Designed for mobile thermal profiles. Thermal guidelines and derating curves are provided in the datasheet
Electrical properties Low-voltage operation per mobile DRAM standards with high-speed interface. Exact voltages, timings, and speed bins are specified in the datasheet
Package or case reference 869 per listing. See datasheet and manufacturer documentation for the precise package code and mechanical drawing
Current status Active in many designs. Availability and lifecycle can vary by speed and bin
Nearing discontinuation No official end-of-life notice known at this time, but status may change
Equivalent or alternative models For exact drop-in or cross-brand alternatives, ball map and timing must match. Please contact Y-IC sales via our website for a tailored list of compatible SK hynix bins and cross references from other major memory vendors
Smartphones and tablets
Wearables and consumer IoT devices
Embedded systems and single-board computers
Networking and communications modules
Automotive infotainment and HMI where mobile DRAM is specified
Industrial handhelds and point-of-sale devices
Y-IC provides the most authoritative datasheet for this product model on our website. For full specifications, pinout, timing tables, mechanical drawings, and compliance details, download the datasheet from this page
Get a Quote on Y-IC now. Learn More and secure allocation today. Limited Time Offer for available stock. Fast response and global shipping.
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H9TQ17A8GTMC-URKUMSKHYNIX |
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