HYNIX H9TP33A6ADMCMR-KDM

Mfr. Part

H9TP33A6ADMCMR-KDM

Manufacturer

HYNIX (SK hynix). Y-IC is a quality distributor for SK hynix. We provide genuine parts, fast delivery, and professional support to ensure you get the best products and services.

Detailed Description

Specialized IC from SK hynix in the H9TP series. This device is an embedded multi‑chip memory (eMCP), typically combining low‑power mobile DRAM (LPDDR-class) with managed NAND flash (eMMC) in one compact BGA package for mobile and embedded designs. Category: Integrated Circuits (ICs), Small Classification: Specialized ICs. Package/Case: 869 (manufacturer package code). Data Code: 11+. Current available quantity: 1387 units in stock.

Key Features

Integrated memory solution: mobile DRAM + managed NAND in one package

High bandwidth, low‑power mobile DRAM interface (LPDDR family, speed grade per suffix)

eMMC managed NAND storage for simplified host interface and robust wear‑leveling

Compact BGA footprint for space‑constrained designs

JEDEC‑aligned interfaces and command sets (LPDDR/eMMC standards)

Lead‑free, RoHS‑compliant manufacturing

Designed for stable operation in handheld and embedded environments

Key Advantages

Saves PCB space versus separate DRAM and NAND devices

Reduces component count and simplifies layout and routing

Shortens design time with a standardized eMMC interface

Improves reliability via integrated management of NAND (bad‑block handling, ECC, wear‑leveling)

Low power consumption optimized for battery‑powered products

Streamlined supply and qualification using a single multi‑chip package

Packaging

Type: Fine‑pitch BGA eMCP

Material: Molded, lead‑free, RoHS‑compliant

Size: eMCP packages typically fall in the ~11–14 mm class; exact outline and height are defined by the 869 package code and the part’s mechanical drawing (see datasheet)

Pin/ball configuration: Ball Grid Array with separate interfaces for LPDDR memory and eMMC; multiple power/ground balls for stable operation; ball map per datasheet

Thermal characteristics: Low thermal mass and efficient heat spreading suitable for mobile devices; follow JEDEC reflow profile and board design guidelines (thermal via and plane recommendations)

Electrical properties (typical for eMCP families; confirm in datasheet):

- LPDDR core voltage around 1.2 V

- LPDDR I/O voltage around 1.2–1.8 V depending on mode

- eMMC supply typically 3.3 V with 1.8 V I/O options on newer speed modes

- I/O standards and timing per LPDDR/eMMC specifications

Moisture Sensitivity Level (MSL): As specified by the manufacturer for the 869 package; typical eMCP devices are MSL 3. Handle and bake per J‑STD‑033 if required.

Lifecycle

Status: Data Code 11+ indicates an earlier generation. Availability may be limited in new builds, and the part may be approaching end‑of‑life or NRND depending on region and lot. We recommend confirming current lifecycle with our sales team.

Equivalent/alternative models: Compatibility must be validated by pinout, density, speed grade, and firmware. Potential alternatives include:

- SK hynix H9TPxx eMCP family parts with matching density/speed and the same 869 package code (e.g., H9TP32…, H9TP37…, H9TP58… variants; suffix differences denote configuration/speed)

- Samsung eMCP (KLMxGx/KE4x/KBx series) with comparable LPDDR + eMMC configurations

- Micron eMCP (MT29TExx series) with similar densities and interfaces

- Kioxia/Toshiba eMCP (THGAF/GFxx series) in compatible BGA footprints

If a direct drop‑in is not identified, please contact our sales team via the Y-IC website for detailed cross‑reference support, availability, and engineering assistance.

Key Application Areas

Smartphones and feature phones

Tablets and e‑readers

Wearables and smart accessories

IoT gateways, home automation hubs

Automotive infotainment and navigation (non‑safety critical)

Handheld industrial terminals and POS devices

Consumer electronics requiring compact high‑bandwidth memory and managed storage

Datasheet

Y-IC hosts the most authoritative datasheet for H9TP33A6ADMCMR-KDM on our product page. We recommend downloading it here to verify exact densities, speed grades, pin maps, electrical limits, mechanical drawings, and lifecycle notes.

Request for Quotation Now

Get a Quote on Y-IC today. Learn More and secure stock while it lasts. Limited Time Offer—submit your RFQ now for best pricing, fast delivery, and technical support.