Microchip Technology A3P060-1TQG144

Mfr. Part

A3P060-1TQG144

Manufacturer

Microchip Technology (ProASIC3 devices originated from Actel/Microsemi; Micrel is also part of Microchip). Y-IC is a quality distributor of Microchip and its legacy brands. We supply genuine parts with reliable service, fast logistics, and technical support.

Detailed Description

Flash-based FPGA from the ProASIC3 series, 60k system gates, 91 user I/O, 18,432 RAM bits, 144-pin TQFP/LQFP 20 x 20 mm, surface-mount, core supply 1.425–1.575 V, commercial temperature 0–85°C (TJ), RoHS3 compliant. Base product number A3P060. Supplied on tray. Instant-on nonvolatile configuration for simple, robust startup.

Key Features

Nonvolatile flash FPGA architecture (no external configuration memory; instant-on)

ProASIC3 logic fabric with embedded RAM blocks and global clock networks

60k system gates for control, glue logic, and protocol bridging

91 user I/O pins in 144-pin TQFP/LQFP package

18,432 total RAM bits for FIFOs, buffers, and small memories

Core voltage 1.425–1.575 V (nominal 1.5 V)

Common LVCMOS/LVTTL I/O standard support (refer to datasheet for full list)

JTAG IEEE 1149.1 programming and boundary-scan test

RoHS3 compliant, lead-free construction

Operating junction temperature range 0–85°C (commercial grade)

Series: ProASIC3; Base product number: A3P060

Key Advantages

Instant-on behavior simplifies power-up and removes the need for external boot memories

Flash configuration is resilient to power glitches and soft errors compared to SRAM-based FPGAs

Lower static power versus many SRAM FPGAs in the same class

Mature, stable platform with long-term availability and proven tooling

Secure design protection features available in the ProASIC3 family

Cost-effective solution for replacing CPLDs and implementing flexible control logic

Packaging

Type: 144-pin TQFP/LQFP, square outline

Body size: 20 mm x 20 mm

Material: Molded epoxy package, copper leadframe, matte-tin plated leads (lead-free, RoHS3)

Pin pitch: typically 0.5 mm for 144-pin LQFP/TQFP

Pin configuration: 91 user I/O; remaining pins for power, ground, JTAG/programming, clocks, and dedicated functions

Mounting: Surface mount; shipment format: Tray

Thermal characteristics: Junction temperature 0–85°C (commercial). Use standard QFP thermal design practices. Refer to datasheet for detailed thermal metrics.

Electrical properties: Core supply 1.425–1.575 V; I/O banks support common LVCMOS/LVTTL levels and related standards; consult datasheet for full voltage tables, timing, and drive strength

Supplier device package: 144-TQFP (20 x 20)

Lifecycle

Status: Active and in production within Microchip’s ProASIC3 family; not indicated as near discontinuation

Close alternatives and upgrades:

- A3P060 in other speed grades (-2, -3) for higher performance needs

- A3P060 in other packages (256-ball FBGA, 208-pin QFP) to adjust I/O count and PCB footprint

- Higher-density ProASIC3 options: A3P125, A3P250, A3P400 for more logic and RAM

- Low-power sister family: IGLOO AGL060 for ultra-low-power designs with similar gate count

Pin-for-pin replacements depend on exact package and temperature grade. For a verified, detailed cross list of ordering codes and drop-in options, please contact our sales team via the Y-IC website for tailored guidance.

Key Application Areas

Industrial control logic, PLC extensions, state machines, and protocol conversion

Communications interface glue (SPI, I2C, UART, GPIO expansion)

Consumer and embedded products requiring instant-on and stable configuration

Medical and test instruments that benefit from nonvolatile, deterministic startup

Power management supervisors and motor control coordination

IoT edge devices and gateways needing simple hardware acceleration and flexible I/O

CPLD replacement with added flexibility and resources

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for A3P060-1TQG144. Download it from this page for complete electrical specs, pinouts, timing, and design guidelines.

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