Microchip Technology A3P060-1FG144

Mfr. Part

A3P060-1FG144

Manufacturer

Micrel / Microchip Technology

Y-IC is a quality authorized distributor for Micrel / Microchip Technology. We focus on genuine parts, fast fulfillment, and expert support to deliver the best products and services to every customer.

Detailed Description

Integrated Circuits (ICs) main category; Embedded FPGAs small classification

ProASIC3 family, flash-based FPGA

60,000 system gates; 18,432 total RAM bits

96 user I/O

Package options noted: 144-FPBGA (13x13), 144-LBGA; Supplier Device Package listed as 144-FPBGA (13x13)

Mounting type: Surface mount

Operating junction temperature: 0°C to 85°C

Core supply voltage: 1.425 V to 1.575 V

RoHS status: Non-compliant

Base product number: A3P060

Ship pack: Tray

Current available quantity: 2637 units

Typical use case: instant-on, nonvolatile FPGA for embedded control and glue logic

Description summary: IC FPGA 96 I/O 144FBGA

Key Features

Flash-based, nonvolatile FPGA (no external configuration memory required)

60k system gates for moderate logic complexity

96 I/O pins for ample interfacing

18,432 bits of on-chip RAM for buffering and small state storage

Compact 144-ball BGA footprint with fine pitch for high-density layouts

Single low-voltage core supply (1.425–1.575 V)

Commercial temperature range (0–85°C TJ)

Surface-mount, grid-array package options for reliable assembly

Key Advantages

Instant-on behavior from on-chip flash configuration

Simplifies BOM and board design by eliminating external config ROM

Stable, low-voltage core reduces power vs. SRAM FPGAs of similar class

Robust embedded control and glue logic replacement with flexible reprogramming

Compact package with good electrical performance for high-speed traces

Mature ProASIC3 ecosystem with proven reliability in industrial and embedded designs

Packaging

Device package type: 144-ball Fine-Pitch BGA (FBGA); LBGA variant also listed

Body size: 13 x 13 mm for the 144-FPBGA package

Ball style: Grid-array interconnect; fine pitch suited for high-density routing

Pin configuration: 144 total balls; 96 user-accessible I/O pins; remaining balls are power, ground, and device-specific functions per datasheet

Material: Molded BGA package with solder ball interconnects; RoHS non-compliant build indicates leaded balls (verify exact alloy in datasheet)

Mounting: Surface mount compatible with standard BGA reflow profiles

Thermal characteristics: Junction temperature rating 0–85°C; thermal performance depends on PCB stack-up and airflow; consult datasheet for typical θJA and recommended thermal design practices

Electrical properties: Core supply 1.425–1.575 V; flash-based architecture supports instant configuration and typically lower static power than SRAM FPGAs

Shipment packaging: Tray for secure handling and automated pick-and-place

Lifecycle

Status: Mature, widely deployed. Not flagged as end-of-life in provided data. RoHS non-compliant build suggests it targets legacy and industrial designs; check current availability for long-term programs.

Equivalent or alternative models:

- Same density, different speed grade and package within ProASIC3 family may be available (for example, A3P060 with -2 speed grade or larger FBGA/LBGA packages offering more I/O). Exact part numbers and pinouts must be confirmed against the datasheet.

- Higher-density family-level alternatives: ProASIC3 devices such as A3P125 provide more logic with similar architecture.

- Newer-generation Microchip flash-based FPGA families (e.g., IGLOO2 or SmartFusion2) may offer enhanced performance, security, and peripherals for new designs.

- For RoHS requirements, Pb-free build options of comparable devices may exist depending on manufacturing codes and region.

Important: Availability, pin-compatibility, and long-term supply should be validated. Please contact Y-IC via our website, and our sales engineers will provide a precise cross-list and lifecycle guidance tailored to your project.

Key Application Areas

Industrial control and automation (instant-on logic, protocol bridging, custom state machines)

Embedded systems and consumer electronics (feature expansion, interface adaptation)

Communication and networking (glue logic, low-latency control, bus translation)

Power systems and motor control (deterministic control logic, protection circuits)

Test and measurement equipment (custom triggers, timing and sequencing)

Security-conscious designs needing nonvolatile configuration (no external bitstream)

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for A3P060-1FG144 on our product page. We recommend downloading the datasheet here to verify electrical limits, pin maps, configuration details, and timing.

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