Microchip Technology A3P060-1FG144I

Mfr. Part

A3P060-1FG144I

Manufacturer

Microchip Technology (ProASIC3 family, legacy Actel/Microsemi line). Y-IC is a quality distributor of Microchip Technology. We deliver genuine parts, fast service, and professional support to ensure you get the best products and the best experience

Detailed Description

Flash‑based FPGA for embedded and control applications. 60k system gates, 96 user I/Os, 18,432 bits of on‑chip RAM, fine‑pitch 144‑ball BGA package, industrial temperature, core supply 1.425 to 1.575 V. Non‑volatile architecture for instant‑on operation and no external configuration memory

Key Features

ProASIC3 series flash FPGA, non‑volatile and reprogrammable

Logic capacity about 60,000 system gates

96 user I/O pins in a compact 144‑ball FPBGA footprint

Embedded RAM 18,432 bits for FIFOs, buffers, and small memories

Industrial temperature capability, junction range from minus 40 to 100 C

Core supply range 1.425 to 1.575 V for low‑power operation

Surface‑mount BGA for high pin count with good signal integrity

RoHS non‑compliant status for applications that permit leaded packages

Base product number A3P060 within the ProASIC3 family for easy migration

Key Advantages

Instant‑on startup with configuration stored in on‑chip flash, no external boot device needed

High reliability configuration storage with strong immunity to soft errors compared to SRAM FPGAs

Low standby power with simple power architecture

Deterministic behavior, suitable for hard real‑time control

Mature tool support and long‑life availability for industrial and infrastructure markets

Small BGA footprint reduces board area while maintaining I/O density

Straightforward power rail design focused on 1.5 V core, easing power sequencing

Packaging

Type FPBGA and LBGA variants, 144‑ball grid array for surface mount assembly

Material Organic BGA substrate with epoxy mold compound and solder balls

Size 13 x 13 mm body outline for space‑constrained designs

Pin configuration 144 balls in a fine‑pitch grid, 96 user I/O pins plus dedicated power, ground, and configuration pins arranged for clean routing and decoupling

Thermal characteristics Junction temperature rating minus 40 to 100 C; actual thermal performance depends on PCB copper, airflow, and heatsinking. Use solid ground planes and ample vias under the package for heat spreading

Electrical properties Core voltage 1.425 to 1.575 V; multiple I/O standards typically supported across I/O banks such as LVCMOS and LVTTL, with bank Vccio options commonly in the 1.5 to 3.3 V range. Consult the datasheet for exact I/O standards and bank voltage limits

Supplier device package 144‑FPBGA 13 x 13 mm

Factory package Tray for secure handling and automated pick‑and‑place

Lifecycle

Status Mature, widely deployed. Not publicly announced as nearing discontinuation at the time of writing, but availability can vary by speed grade and package. For time‑critical programs, confirm lead times with Y‑IC

Equivalent or alternative models within the same family

- A3P060 variants with different speed grades and temperature options, for example A3P060‑2FG144I or A3P060‑1FG144C, offering similar logic with different performance or temperature ranges

- Higher density ProASIC3 devices for more logic or I/O, such as A3P125, A3P250, A3P400, or A3P1000 (check package and pin compatibility carefully)

Modern alternatives from Microchip for enhanced features

- IGLOO2 M2GL devices, for example M2GL010 or M2GL025, offering more modern fabric, SERDES, and hardened features

- SmartFusion2 M2S devices, for example M2S010 or M2S025, combining FPGA fabric with an Arm microcontroller for integrated systems

Note Many alternatives are not pin‑compatible with A3P060‑1FG144I. If you need drop‑in or near‑drop‑in replacements, contact our sales team at Y‑IC and we will recommend exact part numbers based on your board and constraints

Key Application Areas

Industrial control, PLC expansion, and deterministic logic sequencing

Motor control, power conversion supervisors, and timing‑critical protection

Communications interface bridging, protocol adapters, and custom I/O

Test and measurement equipment and instrumentation

Consumer and appliance controllers requiring instant‑on behavior

Secure configuration environments that benefit from non‑volatile FPGA fabric

Medical and infrastructure systems that need stable long‑life components

Datasheet

Y‑IC hosts the most authoritative datasheet for A3P060‑1FG144I on our product page. For complete electrical limits, I/O standards, timing, and detailed ball maps, download the datasheet here on our site to ensure you are using the latest official information

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