Microchip Technology A3P060-1FGG144

Mfr. Part

A3P060-1FGG144

Manufacturer

Micrel / Microchip Technology

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Detailed Description

ProASIC3 flash-based FPGA, 60k system gates, 96 user I/O. 144-ball fine-pitch BGA, 13 x 13 mm body. Commercial temperature grade (TJ 0°C to 85°C). Core supply 1.425 V to 1.575 V. Total RAM 18,432 bits. Surface-mount, tray packaging. RoHS3 compliant.

Key Features

Non-volatile, flash-based FPGA (no external configuration memory needed)

Instant-on startup and deterministic behavior after power-up

60,000 system gates with embedded RAM (18,432 bits)

96 programmable I/O, broad support for common I/O standards (family-dependent; verify in datasheet)

144-ball FPBGA package, compact 13 x 13 mm footprint

Low static and dynamic power compared to SRAM-based FPGAs

Robust security features typical of flash FPGAs (program retention, anti-tamper options; see datasheet)

Standard JTAG programming; supported by Microchip Libero SoC toolchain and FlashPro programmers

RoHS3 compliance

Key Advantages

Simple BOM: no external configuration memory, faster boot

Reliable and predictable startup (instant-on), ideal for control and power sequencing

Lower power draw and good data retention versus SRAM FPGAs

Small package and solid I/O count for space-constrained designs

Mature ecosystem, long-term availability, and proven field history

Easy manufacturing with BGA surface-mount and tray handling

Packaging

Type: 144-ball BGA; listed as FPBGA and LBGA variants

Material: Molded plastic BGA with solder balls

Size: 13 x 13 mm body (fine-pitch BGA)

Pin configuration: 144 balls total; 96 user I/O plus power, ground, and dedicated pins

Mounting: Surface-mount BGA; reflow compatible

Thermal characteristics: Commercial-grade junction temperature 0°C to 85°C; heat is conducted through balls and PCB; follow Microchip thermal layout guidelines

Electrical properties: Core supply 1.425 V to 1.575 V; I/O bank voltages depend on selected standards (confirm in datasheet)

Supplier device package: 144-FPBGA (13 x 13)

Shipping: Tray packaging for automated pick-and-place

Lifecycle

Status: ProASIC3 family is mature and widely deployed. As of current guidance, A3P060 devices are supported and not near immediate discontinuation. Availability can vary by package and speed grade.

Equivalents/alternatives:

- Same-density family options: A3P060 in other packages or speed grades (consult datasheet/order guide for exact codes)

- Lower/higher density within ProASIC3: A3P030 (lower), A3P125 (higher)

- Low-power flash FPGA family: IGLOO AGL devices (e.g., similar-density parts; verify I/O and features)

- Newer Microchip solutions: SmartFusion2 (FPGA + MCU) for modern upgrades (different capabilities)

For a precise cross and the latest lifecycle status of A3P060-1FGG144 and close substitutes, please contact Y-IC via our website. We will match pinout, I/O count, timing, and power needs for you.

Key Application Areas

Industrial control, PLCs, motor control, and drive interfaces

Power sequencing, reset controllers, and system management (benefits from instant-on behavior)

Communications and networking bridges, SERDES-less glue logic, protocol adapters

Consumer and computing peripherals, display and sensor interfacing

Medical and instrumentation signal processing and timing

Security and access control logic (leveraging non-volatile configuration)

Portable and battery-powered devices needing low power and fast startup

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for A3P060-1FGG144 on our product page. We strongly recommend downloading the datasheet here to verify electrical limits, I/O standards, timing, and ordering codes.

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