Microchip Technology A3P060-1FG144T

Mfr. Part

A3P060-1FG144T

Manufacturer

Micrel / Microchip Technology

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Detailed Description

Automotive grade ProASIC3 flash-based FPGA with 60k system gates, 96 user I/O, and 18,432 total RAM bits. Packaged in a 144-ball fine-pitch BGA measuring 13 x 13 mm. Operates from a 1.425 V to 1.575 V core supply. Wide temperature range from -40°C to +125°C ambient. Surface-mount design. RoHS non-compliant. Supplied in tray. Suited for AEC-Q100 applications and instant-on, single-chip designs.

Key Features

ProASIC3 family flash-based FPGA architecture

Automotive AEC-Q100 grade

60,000 system gates and 18,432 RAM bits

96 user I/O

144-FPBGA package, 13 x 13 mm footprint

Core supply 1.425 V to 1.575 V

Operating temperature -40°C to +125°C (TA)

Instant-on behavior and single-chip configuration (no external configuration memory)

Deterministic timing

Surface-mount assembly

Tray packaging

Key Advantages

Nonvolatile flash configuration for immediate startup

Simplified BOM and higher reliability with single-chip solution

Wide automotive temperature support for harsh environments

Compact BGA footprint saves PCB space

Proven ProASIC3 platform with stable tool support

Backed by Microchip’s long-term supply and support ecosystem

Packaging

Type: Fine-Pitch Ball Grid Array, 144-ball

Material: Molded plastic package over organic substrate. Non-RoHS indicates lead-containing ball alloy.

Size: 13 mm x 13 mm body

Pin configuration: 144-ball grid array with banked I/O. Refer to datasheet for ball map and bank assignments.

Thermal characteristics: Rated for -40°C to +125°C ambient. Thermal performance depends on PCB design, copper area, and airflow. Use thermal vias and adequate copper for heat spreading.

Electrical properties: Core supply 1.425 V to 1.575 V, 96 I/O, 60k system gates, 18,432 RAM bits. Refer to datasheet for I/O standards and bank voltages.

Lifecycle

Current status: Generally active within Microchip’s portfolio. No formal end-of-life notice known. Availability can vary by package and temperature grade. Check with us for the latest status.

Equivalent and alternative models from the same family and brand:

- A3P060 family variants with different speed and temperature grades or packages (A3P060 series in alternative BGA options and grades)

- Higher or lower density ProASIC3 options to match resource needs: A3P030, A3P125, A3P250, A3P400, A3P1000

- Low-power and related families where suitable: ProASIC3L, IGLOO

- For exact pin-compatible or drop-in alternatives, contact Y-IC sales. Pinouts and speed grades vary by package and suffix.

If you need a one-to-one verified replacement, please contact our sales team via our website for detailed cross-references and availability.

Key Application Areas

Automotive modules and sensor interfaces requiring instant-on logic

Industrial control, motor control, PLC and factory automation

Secure system management and configuration control

Interface bridging, glue logic, protocol adaptation

Embedded designs needing fast startup and deterministic FPGA behavior

Instrumentation and power management control

Datasheet

Y-IC provides the most authoritative datasheet for this product on our website. We recommend downloading the datasheet from this page to get full specifications, ball maps, timing, and design guidelines.

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