Microchip Technology A3P060-1FGG144I

Mfr. Part

A3P060-1FGG144I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

ProASIC3 flash-based FPGA, 60k system gates, 96 user I/O, industrial temperature, 144-ball fine-pitch BGA 13 x 13 mm. Non-volatile, instant-on architecture. 18,432 RAM bits. Core supply 1.425 V to 1.575 V. Surface-mount. RoHS3 compliant. Series ProASIC3. Base product number A3P060.

Key Features

Flash-based FPGA, non-volatile, instant-on

60k system gates with 18,432 embedded RAM bits

96 user I/O in a 144-ball FBGA package

Industrial operating temperature -40°C to 100°C (TJ)

Core supply 1.425 V to 1.575 V

JTAG in-system programming and boundary scan

Clock management resources and global clock networks

Wide I/O standard support across banks (typical LVCMOS/LVTTL levels)

Secure design protection features for IP security

RoHS3 compliant, lead-free manufacturing

Supported by Microchip Libero SoC design tools

Key Advantages

Instant-on operation, no external configuration memory needed

High reliability configuration storage that is immune to power-up glitches

Lower power than SRAM-based FPGAs, reduced BOM and board area

Simple power sequencing and easy system integration

Industrial-grade robustness and wide temperature range

Long-term availability backed by Microchip and Y-IC supply chain

Strong security features to protect your design

Mature ecosystem, proven in industrial and embedded applications

Packaging

Type: Fine-Pitch Ball Grid Array, FBGA

Body size: 13 mm x 13 mm

Ball count: 144 balls, user I/O 96 plus power, ground, JTAG, and system pins

Ball pitch: typically 1.0 mm (check datasheet for exact pitch)

Material: Molded epoxy body, lead-free SAC solder balls, RoHS3 compliant

Height: Low-profile BGA variant available (LBGA)

Mounting: Surface mount technology

Thermal characteristics: TJ -40°C to 100°C; actual thermal performance depends on PCB copper, airflow, and heatsinking

Electrical properties: Core 1.425 V to 1.575 V; I/O banks support common 1.5/1.8/2.5/3.3 V LVCMOS/LVTTL standards; IEEE 1149.1 JTAG; differential I/O options such as LVDS may be supported on selected pins (verify per bank in datasheet)

Supplier device package: 144-FPBGA (13x13)

Factory tray packing for shipment and assembly

Moisture sensitivity: typical FBGA MSL ratings apply; follow JEDEC handling and baking guidelines per datasheet

Lifecycle

Status: ProASIC3 family is mature and actively supported by Microchip; not near discontinuation based on current public guidance

Direct variants within the same family and resource class A3P060:

- A3P060-1FGG144 (commercial temperature, same package and speed grade)

- A3P060-2FGG144I (industrial temperature, faster speed grade)

- Other A3P060 options exist across speed grades (-1, -2), temperature grades (C, I, extended), and packages (FBGA, LBGA, selected QFP options). Availability and pinout differ by option; verify details in the datasheet or contact us.

Alternative families for similar use cases:

- IGLOO AGL060 (low-power flash FPGA, similar logic density)

- ProASIC3L A3P060L (low-power variant within ProASIC3 family)

- SmartFusion2 M2S010 (SoC FPGA with integrated Arm Cortex-M3, higher feature set)

- PolarFire MPF050T or MPF100T (modern low-power mid-range FPGAs; not drop-in)

Note: Alternatives above are not pin-compatible. Verify footprint, I/O banks, timing, and tool support. If you need exact drop-in or form-fit-function guidance, contact our sales team via the Y-IC website for the latest cross-reference and lifecycle updates.

Key Application Areas

Industrial control, PLC and motion systems, deterministic logic

Protocol bridging and interface glue logic for embedded systems

Medical instrumentation and test equipment requiring instant-on

Communications and networking modules needing low power FPGAs

Secure devices where configuration protection matters

Consumer and appliance control with fast boot and reliable operation

Aerospace and defense COTS designs that favor non-volatile FPGAs

Power sequencing, sensor aggregation, and custom state machines

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for this product. Download the A3P060-1FGG144I datasheet from this page to get complete specifications, pinouts, I/O standards, timing, and design guidelines.

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