Microchip Technology A3P060-1FGG144T

Mfr. Part

A3P060-1FGG144T

Manufacturer

Micrel / Microchip Technology. Y-IC is a quality distributor of Micrel / Microchip Technology, and we will provide you with the best products and services.

Detailed Description

Automotive-grade, AEC-Q100 qualified ProASIC3 FPGA with 60k system gates, 96 user I/Os, 18,432 RAM bits, and a 144-ball Fine-Pitch BGA package (13 mm x 13 mm). Operates from a 1.425 V to 1.575 V core supply. Wide temperature range from -40°C to +125°C. Surface-mount, RoHS3 compliant, shipped in tray.

Key Features

ProASIC3 flash-based FPGA architecture for non-volatile, instant-on operation

Automotive AEC-Q100 qualification for high reliability in harsh environments

60,000 system gates and 18,432 total RAM bits for balanced logic and memory resources

96 programmable I/Os for flexible interfacing

144-FPBGA package, 13 x 13 mm footprint for compact designs

Core supply range 1.425 V to 1.575 V for stable, low-power operation

Wide operating temperature -40°C to +125°C (TA)

RoHS3 compliant materials and lead-free solder balls

Part of the Automotive ProASIC3 series for long-term availability and support

Key Advantages

Instant-on, no external configuration memory required

Non-volatile flash technology improves robustness and simplifies power-up

Low power and small footprint reduce system thermal load and PCB area

Automotive qualification supports mission-critical reliability

Stable single core voltage simplifies power design

Proven ProASIC3 ecosystem with mature toolchain and application notes

Secure, deterministic startup ideal for safety-related and time-critical systems

Packaging

Type: Fine-Pitch Ball Grid Array, low-profile BGA options available

Material: Molded plastic overmold with lead-free solder balls, RoHS3 compliant

Size: 13 mm x 13 mm body, 144-ball count

Pin configuration: 144-ball BGA with 96 user I/Os; remaining balls used for power, ground, and control

Thermal characteristics: Wide ambient range -40°C to +125°C; BGA layout supports good heat spreading through planes and vias

Electrical properties: Core supply 1.425 V to 1.575 V; 60k system gates; 18,432 RAM bits; 96 I/Os

Mounting: Surface-mount, compatible with standard lead-free reflow profiles

Package case options referenced: 144-FPBGA (13x13), 144-LBGA

Supplier device package: 144-FPBGA (13x13)

Shipping format: Tray

Lifecycle

Status: Active with long-lifecycle support in the Automotive ProASIC3 family

Not nearing discontinuation based on current family status

Equivalent or alternative models:

- Same family, different densities to match resource needs: A3P030, A3P125, A3P250

- Same base product number with different speed grades or packages within the A3P060 family may be available

- For pin-compatible drop-in alternatives in 144-FPBGA and for exact automotive-grade matches, please contact our sales team via the Y-IC website to verify availability and compatibility

If you need a direct replacement or a higher/lower resource variant, reach out to our sales team on our website for model matching and lifecycle guidance

Key Application Areas

Automotive: body control modules, instrument clusters, gateway and network nodes, motor control, sensor fusion, powertrain subsystems

Industrial: programmable logic control, robotics, motor drives, smart I/O expansion, protocol bridging

Transportation and aerospace: control, monitoring, safety interlocks

Medical and instrumentation: data acquisition, interface adaptation, sequencing logic

Communications: glue logic, low-latency bridging, custom interfaces

Security and safety: deterministic startup control, supervisory logic

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for this product model. Download the datasheet directly on this page to get full specifications, electrical characteristics, timing, and design guidelines.

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