Texas Instruments OMAPL138BZCED4E

Mfr. Part

OMAPL138BZCED4E

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

High-integration ARM926EJ-S + C674x DSP embedded microprocessor from the OMAP-L1x series. Runs up to 456 MHz. Single 32-bit core with on-chip signal processing and system control co-processors. Rich connectivity: 10/100 Ethernet, USB 1.1 + PHY, USB 2.0 + PHY, SATA 3 Gbps, LCD controller, SDRAM controller, and multiple serial interfaces (HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART). Security features include boot security and cryptography. Device comes in a 361-ball 13 x 13 mm BGA. Surface-mount. Junction temperature range -40°C to 90°C. I/O voltages 1.8 V and 3.3 V. RoHS non-compliant. Package type: Tray. Base product number: OMAPL138. Category: Integrated Circuits (ICs). Subcategory: Embedded – Microprocessors. Available quantity: 2690.

Key Features

Core processor: ARM926EJ-S, 32-bit, up to 456 MHz

Co-processors/DSP: C674x signal processing, system control, ARM CP15

Ethernet: 10/100 Mbps (1 port)

USB: 1x USB 1.1 + PHY, 1x USB 2.0 + PHY

Storage interface: SATA 3 Gbps (1)

Display: LCD controller (no dedicated graphics acceleration)

Memory controller: SDRAM

Additional interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

Security: boot security, cryptography

I/O voltages: 1.8 V and 3.3 V

Operating temperature (junction): -40°C to 90°C

Mounting: Surface mount

Series: OMAP-L1x

Device package: 361-ball BGA, 13 x 13 mm

RoHS: Non-compliant

Key Advantages

Heterogeneous computing with ARM + C674x DSP for balanced control and high-performance signal processing on one chip

Integrated PHYs (USB) and rich connectivity reduce BOM, board space, and design time

Proven OMAP-L1x platform with broad ecosystem, tools, and community resources

Industrial-ready temperature range and robust peripheral set for long-term deployments

Flexible I/O voltages (1.8 V/3.3 V) simplify interfacing with common sensors and peripherals

Compact 13 x 13 mm BGA enables dense layouts and smaller products

Security features support secure boot and cryptographic protection for firmware and data

Available stock (2690 units) helps accelerate prototyping and production

Packaging

Type: Ball Grid Array (BGA), TI denotes NFBGA; some sources list LFBGA. Functionally a 361-ball fine-pitch BGA.

Size: 13 mm x 13 mm body; low-profile height

Ball count and layout: 361 balls in a 19 x 19 matrix

Material: Organic BGA substrate; SnPb solder balls (RoHS non-compliant variant)

Mounting: Surface mount, reflow soldering

Pin configuration: Mixed-signal ballout with dedicated regions for power rails (core, I/O), memory interfaces (SDRAM), high-speed I/O (USB, SATA), and control/serial interfaces (Ethernet MII/RMII, I2C, SPI, UART, McASP/McBSP, HPI)

Thermal characteristics: Junction temperature -40°C to 90°C; use solid ground planes, thermal vias, and appropriate airflow to manage heat

Electrical properties: I/O supply rails at 1.8 V and 3.3 V; core frequency up to 456 MHz; consult the datasheet for detailed rail requirements, decoupling, and timing

Shipment: Tray packaging for factory assembly

Lifecycle

Status: OMAP-L1x devices are mature and widely deployed. Lifecycle status can vary by specific suffix and temperature/ball composition option; check with Y-IC for the latest status of OMAPL138BZCED4E.

Nearing discontinuation: No general end-of-life notice is known for the broader OMAP-L138 family, but some variants may be NRND or have restricted availability. Confirm current status before new designs.

Equivalent or alternative models (evaluate datasheet and pinout carefully):

- OMAP-L138-EP (Extended Product; similar architecture, enhanced longevity options)

- OMAP-L137 (ARM9 + C674x DSP, related family, different feature balance)

- DA830 / DA850 (TI DaVinci family, closely related devices; many designs consider them as practical alternatives)

- AM1808 / AM1810 (Sitara ARM9; ARM-only alternatives without the C674x DSP, suitable if DSP is not required)

If you need exact drop-in compatibility or no listed alternative fits, contact our sales team via the Y-IC website for expert guidance and the latest cross-reference support.

Key Application Areas

Industrial control, PLCs, and factory automation

Motor control and real-time drive systems using DSP acceleration

Audio processing, voice interfaces, and professional audio (McASP)

HMI panels with LCD, barcode scanners, printers, and kiosks

Networking gateways, industrial Ethernet nodes, and IoT edge devices

Medical instrumentation and patient monitoring

Test and measurement equipment and data acquisition

Smart energy and metering systems

Security appliances with secure boot and cryptography

Datasheet

Y-IC hosts the most authoritative datasheet and technical documentation for OMAPL138BZCED4E. We recommend downloading the datasheet directly from this page to get complete electrical specs, pinout, timing, and design guidelines.

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