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| Part Number: | OMAPL138BZWTA3R |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | IC MPU OMAP-L1X 375MHZ 361NFBGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - I/O | 1.8V, 3.3V |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
| Supplier Device Package | 361-NFBGA (16x16) |
| Speed | 375MHz |
| Series | OMAP-L1x |
| Security Features | Boot Security, Cryptography |
| SATA | SATA 3Gbps (1) |
| RAM Controllers | SDRAM |
| Package / Case | 361-LFBGA |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 105°C (TJ) |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Mounting Type | Surface Mount |
| Graphics Acceleration | No |
| Ethernet | 10/100Mbps (1) |
| Display & Interface Controllers | LCD |
| Core Processor | ARM926EJ-S |
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 |
| Base Product Number | OMAPL138 |
| Additional Interfaces | HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART |




Series OMAP-L1x
Luminary Micro Texas Instruments
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32-bit ARM926EJ-S microprocessor with integrated C674x DSP for real-time signal processing
Up to 375 MHz operating speed for the ARM core and DSP tasks in this speed grade
Industrial grade temperature range minus 40 to 105 degrees Celsius junction
Rich connectivity set 10 100 Ethernet, USB 1.1 with PHY, USB 2.0 with PHY, SATA 3 Gbps
Display controller for LCD panels
Security features include boot security and cryptography
Memory controller supports SDRAM
Package is 361-ball NFBGA LFBGA body size 16 mm by 16 mm suitable for surface mount assembly
RoHS3 compliant lead free
Supplier device package 361-NFBGA 16 by 16
Packaging format Tape and Reel TR
Quantity available 2685 units
ARM926EJ-S CPU with CP15 system control for cache and memory management
Integrated C674x DSP co-processor for high performance signal processing
1 core 32-bit CPU with DSP acceleration for mixed control and processing workloads
375 MHz speed grade for responsive embedded applications
Ethernet 10 100 for networking and industrial communications
Two USB ports one USB 1.1 with PHY and one USB 2.0 with PHY for host or device applications
SATA 3 Gbps interface for storage and data logging
LCD controller for human machine interfaces and basic graphics
Security features boot authentication and cryptography support
RAM controller for SDRAM for low cost memory expansion
Interfaces include HPI I2C McASP McBSP MMC SD SPI UART for broad peripheral connectivity
RoHS3 compliant for global environmental standards
Mounting type surface mount compatible with modern SMT lines
Balanced architecture ARM9 for control and UI plus C674x DSP for real time signal processing
Rich built in peripherals reduce the need for extra chips and lower BOM cost
Industrial temperature and robust design fit for harsh environments
Integrated PHYs on USB save board space and design effort
SATA 3 Gbps enables fast local storage and data capture
Proven TI ecosystem tools libraries and long life support reduce development risk
Low power ARM9 core compared to higher end application processors for efficient designs
Straightforward migration path within OMAP-L1x and TI Sitara families
format Tape and Reel TR
Quantity available 2685 units
Key Features
ARM926EJ-S CPU with CP15 system control for cache and memory management
Integrated C674x DSP co-processor for high performance signal processing
1 core 32-bit CPU with DSP acceleration for mixed control and processing workloads
375 MHz speed grade for responsive embedded applications
Ethernet 10 100 for networking and industrial communications
Two USB ports one USB 1.1 with PHY and one USB 2.0 with PHY for host or device applications
SATA 3 Gbps interface for storage and data logging
LCD controller for human machine interfaces and basic graphics
Security features boot authentication and cryptography support
RAM controller for SDRAM for low cost memory expansion
Interfaces include HPI I2C McASP McBSP MMC SD SPI UART for broad peripheral connectivity
RoHS3 compliant for global environmental standards
Mounting type surface mount compatible with modern SMT lines
Key Advantages
Balanced architecture ARM9 for control and UI plus C674x DSP for real time signal processing
Rich built in peripherals reduce the need for extra chips and lower BOM cost
Industrial temperature and robust design fit for harsh environments
Integrated PHYs on USB save board space and design effort
SATA 3 Gbps enables fast local storage and data capture
Proven TI ecosystem tools libraries and long life support reduce development risk
Low power ARM9 core compared to higher end application processors for efficient designs
Straightforward migration path within OMAP-L1x and TI Sitara families
Packaging
Type 361-ball NFBGA LFBGA suitable for high density designs
Material lead free SAC solder balls on organic substrate compliant with RoHS3
Size body 16 mm by 16 mm low profile height per TI spec
Ball pitch typical 0.8 mm for this ZWT package confirm in TI datasheet
Ball count 361 balls organized in grid with dedicated power ground and I O banks
Pin configuration groups for memory interfaces high speed serial Ethernet USB SATA and control signals refer to package ball map
Thermal characteristics junction temperature minus 40 to 105 degrees Celsius typical Theta values depend on board and airflow check datasheet
Electrical properties I O voltage 1.8 V and 3.3 V core and analog rails per TI spec consult datasheet for exact rails and limits
Moisture sensitivity level typical MSL 3 for BGA verify exact MSL in datasheet
Packaging format Tape and Reel for automated pick and place
Current understanding active in production as part of TI OMAP-L1x family check our website for latest status
Not indicated as near discontinuation at this time
Equivalent and alternative models depending on needs
- OMAP-L138 speed grade and package variants such as OMAPL138AZWT and OMAPL138BZWTA5 compare frequency and features
- OMAP-L137 similar family device with different peripheral mix
- OMAP-L132 cost optimized variant with reduced features
- TMS320C6748 DSP only if you need the DSP without ARM
- Sitara AM1808 AM1810 ARM9 based if you only need ARM without DSP
- Sitara AM335x Cortex-A8 for higher performance and modern peripherals if you want a newer architecture
If you need a drop in or form fit alternative or you do not see a suitable equivalent contact our sales team via the Y-IC website for tailored guidance
Industrial control and automation PLCs and motion controllers
Human machine interfaces LCD based operator panels
Motor drives and power conversion with DSP based control loops
Audio processing and voice handling using C674x DSP
Medical and laboratory equipment data acquisition and control
Networking gateways and IoT edge devices with Ethernet and USB
Printers scanners barcode readers and point of sale systems
Storage and data logging systems using SATA 3 Gbps
Test and measurement instruments mixed signal processing
Smart grid and building automation controllers
Y-IC hosts the most authoritative datasheet and technical resources for this product
Download the datasheet on this page to get exact specifications pin maps thermal data and design guidelines
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