Texas Instruments OMAPL138BGWTMEP

Mfr. Part

OMAPL138BGWTMEP

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

High-integration embedded microprocessor from the OMAP-L1x family combining a 345 MHz ARM926EJ-S core with a C674x DSP co-processor. Built for harsh environments with EP-grade extended temperature operation. Features rich connectivity including Ethernet, USB with PHYs, SATA, LCD controller, and multiple serial interfaces. RoHS3 compliant and optimized for space-saving BGA packaging.

Key Features

Core processor ARM926EJ-S at 345 MHz, 32-bit, 1 core

Integrated C674x DSP for signal processing

EP-grade operating range -55°C to +125°C junction

Ethernet 10/100 Mbps (1 port)

USB 1.1 + PHY (1) and USB 2.0 + PHY (1)

SATA 3 Gbps (1)

LCD display controller (no graphics acceleration)

Security features Boot Security and Cryptography support

Memory controller SDRAM

Additional interfaces HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

I/O voltages 1.8 V and 3.3 V

Mounting type Surface Mount

Series OMAP-L1x

RoHS ROHS3 Compliant

Key Advantages

ARM + DSP architecture delivers balanced control and high-performance signal processing on one chip

Extended temperature EP-grade for industrial, military, and mission-critical designs

On-chip PHYs reduce BOM cost and simplify design for USB

Broad interface set enables flexible system integration without extra controllers

Proven TI ecosystem with long-term availability and robust software support

Low-power operation with selectable I/O voltages for energy-sensitive applications

Packaging

Type 361-ball BGA in NFBGA and LFBGA options

Body size 16 mm x 16 mm nominal

Ball count and grid 361-ball array for high pin density

Material Molded plastic BGA with lead-free balls, RoHS3 compliant

Pin configuration Grid array; detailed ball map and signal assignments available in the datasheet

Thermal characteristics Junction temperature rating -55°C to +125°C (EP). Thermal performance depends on PCB design, copper area, airflow, and enclosure. Use solid ground planes and adequate thermal vias; consider heat spreading where needed.

Electrical properties I/O operation at 1.8 V and 3.3 V. Signal integrity benefits from short traces and controlled impedance routing for high-speed interfaces (USB, SATA, EMAC). Refer to power rail recommendations and decoupling requirements in the datasheet.

Supplier device package 361-NFBGA (16x16)

TI package case listings 361-NFBGA (16x16) and 361-LFBGA

Shipping package Tube for assembly-line convenience

Lifecycle

Status Active and not nearing discontinuation based on the EP-grade OMAP-L1x family’s long-term industrial focus

Recommended equivalents and alternatives

- OMAPL138B-EP Newer silicon revision in the same family with similar features and extended temperature

- OMAP-L137-EP Similar ARM9 + C674x DSP architecture with different peripheral mix and performance points

- AM1808 If only ARM9 control is required without DSP, similar peripherals but no C674x

- TMS320C6748 If DSP-only processing is desired without an ARM core, similar DSP capabilities

- Packaging variants of OMAP-L138 Standard-temperature versions and different BGA options depending on design needs

If your application requires a drop-in mechanical or software-compatible option, or you need verification for a specific alternative, contact our sales team via the Y-IC website for tailored guidance

Key Application Areas

Industrial control and automation

Motor drives and motion control

Test and measurement instruments

Medical devices and patient monitoring

Military and aerospace systems (extended temp EP-grade)

Audio processing and voice systems (McASP, DSP)

Networking and gateways (Ethernet, USB, SATA)

Human–machine interfaces with LCD panels

Datasheet

Y-IC hosts the most authoritative datasheet for this product model on our website. We recommend downloading the datasheet from this page to get complete pinouts, electrical specs, timing, power rails, boot options, and design guidelines.

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