Texas Instruments OMAPL138BZWTA4

Mfr. Part

OMAPL138BZWTA4

Manufacturer

Luminary Micro/Texas Instruments. Y-IC is a quality distributor for TI. We supply genuine parts, fast delivery, and dependable technical support. Count on Y-IC for the best products and services.

Detailed Description

High-integration embedded ARM processor with DSP for real-time signal processing. Combines an ARM926EJ-S core (32-bit) running up to 456 MHz with a TI C674x DSP co-processor, plus rich peripherals: 10/100 Ethernet, USB 1.1 + PHY, USB 2.0 + PHY, SATA 3 Gbps, LCD controller, SDRAM controller, and extensive serial interfaces. Industrial temperature range and RoHS3 compliance. Package is a 361-ball fine-pitch BGA for compact designs. Quantity available: 2676 units in tray packaging.

Key Features

Core processor: ARM926EJ-S, 32-bit, up to 456 MHz

DSP co-processor: TI C674x for real-time signal processing

Security: Boot security and cryptography

Ethernet: 10/100 Mbps (1 port)

USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)

SATA: 3 Gbps (1 port)

Display: LCD controller (no dedicated graphics acceleration)

Memory: SDRAM controller

Additional interfaces: HPI, I2C, McASP (audio), McBSP, MMC/SD, SPI, UART

System control: CP15

I/O voltages: 1.8 V and 3.3 V

Operating temperature: -40°C to +105°C (TJ)

Mounting type: Surface mount

RoHS: ROHS3 Compliant

Series: OMAP-L1x

Base product number: OMAPL138

Key Advantages

Dual-processor architecture (ARM + C674x DSP) for balanced control and high-throughput signal processing on one chip

Rich connectivity on-chip (Ethernet, USB, SATA, LCD) reduces external components and PCB complexity

Industrial temperature range for harsh environments

Integrated USB PHYs simplify hardware design and cut BOM cost

Proven TI ecosystem with toolchains, SDKs, and long-term support

Low-power ARM9 core suitable for embedded Linux or RTOS

Flexible peripheral set for audio, storage, networking, and HMI applications

RoHS3 compliance for global regulatory requirements

Packaging

Type: Ball Grid Array (BGA), surface-mount

Case options: 361-NFBGA (16x16), 361-LFBGA

Supplier device package: 361-NFBGA (16x16)

Ball count and arrangement: 361 balls in a 16 x 16 array (see datasheet for pinout/ball map)

Material: Lead-free, RoHS3-compliant plastic BGA

Thermal characteristics: Junction temperature -40°C to +105°C; use good PCB thermal design for heat spreading

Electrical properties: I/O at 1.8 V and 3.3 V; core and peripheral rails per datasheet

Mounting: Surface mount reflow

Shipment packaging: Tray

Lifecycle

Status: Active in the OMAP-L1x family as of the latest available information; no public notice of near-term discontinuation

Close equivalents and alternatives (choose based on needed features):

- OMAP-L138 family speed/package variants (e.g., other OMAPL138ZWT/ZWTA speed grades)

- OMAP-L137 (ARM9 + C674x DSP, similar peripheral mix with variations)

- OMAP-L132 (ARM9 + C674x DSP, cost-optimized feature set)

- AM1808 (ARM9 only, no C674x DSP; similar connectivity for control-centric designs)

- TMS320C6748 (DSP-only; pair with external MCU if needed)

If you need a precise drop-in equivalent or a tailored alternative, contact Y-IC via our website. Our sales team will verify lifecycle status and recommend the best match for your design.

Key Application Areas

Industrial control, automation, and PLCs

Motor control and drives with real-time DSP tasks

Audio and voice processing (pro audio, intercoms, conferencing)

Human–machine interfaces (HMI) with LCD panels

Networking and gateways (Ethernet, USB connectivity)

Data acquisition, measurement, and test equipment

Medical devices and portable diagnostics

POS terminals, printers, and barcode systems

Embedded Linux or RTOS-based systems needing both control and signal processing

Datasheet

Y-IC hosts the most authoritative datasheet and technical documents for OMAPL138BZWTA4 on our product page. We recommend downloading the datasheet here to get full pinout, electrical specs, timing, and design guidelines.

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