Texas Instruments OMAPL138BZCG4

Mfr. Part

OMAPL138BZCG4

Manufacturer

Luminary Micro and Texas Instruments

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Detailed Description

High-integration ARM926EJ-S based microprocessor with integrated C674x DSP for signal processing

Core speed up to 456 MHz with 1 core 32-bit ARM and on-chip DSP accelerators for real-time workloads

OMAP-L1x series base product number OMAPL138

Embedded microprocessor category under Integrated Circuits

Peripherals include 10/100 Ethernet, USB 1.1 with PHY, USB 2.0 with PHY, SATA 3 Gbps, LCD controller, SDRAM controller

Security features include boot security and cryptography

Interfaces include HPI, I2C, McASP, McBSP, MMC and SD, SPI, UART

Graphics acceleration not present

RoHS3 compliant

Mounting type surface mount

Operating junction temperature 0 to 90 C

Supplier device package 361-ball NFBGA 13 x 13 mm with 361-ball LFBGA case variant

Package supplied in tray

Available quantity at Y-IC 2675 units

Key Features

ARM926EJ-S core at 456 MHz for general-purpose compute

Integrated C674x DSP for math and signal processing

10/100 Ethernet MAC for network connectivity

USB 1.1 with PHY and USB 2.0 with PHY for host and device use

SATA 3 Gbps interface for storage when supported by the specific device configuration

LCD controller for simple display panels and HMI

SDRAM controller for external memory expansion

Hardware security for secure boot and cryptographic functions

Rich audio and communication interfaces including McASP and McBSP

Multiple serial interfaces including I2C, SPI, UART, HPI

1.8 V and 3.3 V I O support

RoHS3 compliant for environmental standards

Compact 361-ball BGA package 13 x 13 mm

Key Advantages

ARM plus DSP on one chip reduces BOM and board space while boosting real-time performance

Broad peripheral set covers networking, USB, storage, display and industrial I O in one device

Proven TI OMAP-L1x platform with long-term availability and ecosystem support

Flexible memory and interface options make design reuse and migration easier

Low power ARM9 core with efficient DSP for strong performance per watt

Security features enable trusted boot and safer firmware updates

Simple path to Linux or RTOS and DSP libraries to speed development

Packaging

Package type NFBGA and LFBGA options with 361 balls for high pin count integration

Material plastic molded BGA over organic substrate industry standard

Body size approximately 13 mm x 13 mm

Pin configuration 361-ball grid array refer to the datasheet ball map for exact placement and pitch

Thermal characteristics junction temperature range 0 to 90 C good PCB heat spreading and airflow recommended

Electrical properties I O voltages 1.8 V and 3.3 V core speed up to 456 MHz Ethernet 10/100 USB 1.1 and 2.0 with PHY SATA 3 Gbps LCD controller SDRAM controller

Supplier device package 361-NFBGA 13 x 13

Case variant 361-LFBGA

Mounting type surface mount

Shipment packaging tray for safe handling and pick-and-place

Lifecycle

Current status active and widely deployed in industrial and embedded designs based on TI OMAP-L1x family

Not near discontinuation according to typical TI longevity for industrial parts check the latest TI product bulletin for confirmation

Functionally similar and family alternatives verify pinout and features in the datasheet before substitution

- OMAP-L138 family speed and temperature variants often pin compatible within the 361-ball package

- OMAP-L137 ARM9 plus C674x DSP variant with different peripheral mix potentially pin compatible in selected packages

- OMAP-L132 cost-optimized variant for applications needing fewer features

- AM1808 ARM9 only device commonly pin compatible with OMAP-L138 for designs not requiring the DSP

- AM1810 ARM9 with LCD and industrial interfaces variant depending on features needed

- TMS320C6748 DSP-only device for projects focused on pure signal processing without the ARM9

If you need an exact drop-in equivalent or the latest lifecycle notice contact our sales team via the Y-IC website for detailed guidance and compatibility checks

Key Application Areas

Industrial control and automation PLC remote I O and gateways

Human machine interface panels with LCD

Motor control and drives requiring real-time DSP math

Audio processing mixers codecs teleconferencing and beamforming through McASP McBSP

Networked devices Ethernet-enabled controllers and data loggers

Medical instrumentation and patient monitoring with signal processing needs

Test and measurement equipment oscilloscopes analyzers and data acquisition

Building and energy management systems security panels smart meters and power quality analysis

Storage and connectivity embedded USB and SATA interfaces when enabled

Embedded Linux or RTOS systems that need secure boot and rich peripherals

Datasheet

Our website provides the most authoritative datasheet for OMAPL138BZCG4

We recommend downloading the datasheet from this page to get complete electrical characteristics pin maps timing and design guidelines

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