Texas Instruments OMAPL138BZCE3

Mfr. Part

OMAPL138BZCE3

Manufacturer

Luminary Micro Texas Instruments

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Detailed Description

OMAP-L138 ARM9 plus C674x DSP application processor in a 361-ball NFBGA 13 x 13 mm package

375 MHz ARM926EJ-S core with integrated DSP for real-time signal processing

Rich connectivity including Ethernet 10/100, USB 2.0 with PHY, USB 1.1 with PHY, SATA 3 Gbps, LCD controller, and multiple serial interfaces

RoHS3 compliant and designed for surface-mount production

Series OMAP-L1x, Base product number OMAPL138

Current available quantity 2632 units

Package Tray

Key Features

ARM926EJ-S CPU running up to 375 MHz

Integrated C674x DSP for high-performance signal processing

32-bit bus width single core ARM architecture with DSP co-processor

SDRAM controller for external memory

Ethernet 10/100 Mbps MAC

USB 2.0 with onboard PHY and USB 1.1 with onboard PHY

SATA 3 Gbps port

LCD display controller

Security features including secure boot and cryptography

Additional interfaces I2C, HPI, McASP, McBSP, MMC SD, SPI, UART

Graphics acceleration not included

Operating junction temperature 0 to 90 C

I O voltage rails 1.8 V and 3.3 V

RoHS3 compliant

Mounting type Surface Mount

Key Advantages

Dual architecture efficiency ARM9 for control plus C674x DSP for real-time processing on one chip

On-chip PHYs for USB reduce BOM cost and simplify hardware design

Integrated LCD controller and broad peripheral set speed up product development

SATA 3 Gbps support enables fast storage and logging

Secure boot and crypto features strengthen device security

Mature TI ecosystem with tools, libraries, and long-term availability

Cost-effective platform for embedded systems needing both control and DSP

Packaging

Type 361-ball NFBGA low-profile fine-pitch BGA

Material lead-free construction per RoHS3 compliant manufacturing

Size 13 mm x 13 mm body

Pin configuration 361-ball grid array optimized for high-speed signals and power distribution

Thermal characteristics operating junction temperature 0 to 90 C typical of commercial grade

Electrical properties I O rails at 1.8 V and 3.3 V CPU up to 375 MHz integrated PHYs for USB and 10 100 Ethernet support SATA 3 Gbps

Supplier device package 361-NFBGA 13 x 13 mm

Alternate described case 361-LFBGA noted in some listings

Mounting Surface Mount

Shipping Package Tray for automated assembly

Lifecycle

Status generally active in the TI OMAP-L1x family based on current industry information

Not indicated as nearing discontinuation at this time

Equivalent or alternative models to consider

- OMAP-L138 family variants with different speed grades temperature ranges and packages

- OMAP-L137 similar ARM9 DSP architecture with adjusted features

- Sitara AM1808 or AM1810 ARM9 processors as ARM-only alternatives without integrated DSP

- TMS320C6748 DSP only if you need DSP without ARM control core

- AM335x Cortex-A8 family as a newer ARM alternative if migrating architectures

Pin compatibility feature parity and software migration vary by option

For a full cross reference and the best replacement advice please contact our sales team via the Y-IC website

Key Application Areas

Industrial control and factory automation PLCs and RTUs

Human machine interfaces HMI and operator panels with LCD

Motor control and power conversion with real-time DSP

Medical devices and patient monitoring

Test and measurement instrumentation and data acquisition

Audio processing and voice systems

Networked gateways and edge devices with Ethernet USB and storage

Printers scanners POS terminals and barcode readers

Security systems with encrypted boot and secure communication

Datasheet

Y-IC hosts the most up-to-date and authoritative datasheet for this model on our website

Download the datasheet on this page to get full electrical specifications pin maps and design guidelines

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