Texas Instruments OMAPL138BZCEA3

Mfr. Part

OMAPL138BZCEA3

Manufacturer

Luminary Micro Texas Instruments

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Detailed Description

High-integration embedded microprocessor from the OMAP-L1x family combining an ARM926EJ-S CPU with a C674x DSP for signal processing

375 MHz performance in a compact 361-ball NFBGA 13 x 13 mm package

Industrial temperature range minus 40 to 105 degrees Celsius junction

Full peripheral set including Ethernet 10 100, USB 1.1 and USB 2.0 with integrated PHYs, LCD controller, SATA 3 Gbps, SDRAM controller, security features, and rich serial interfaces

RoHS3 compliant device supplied in tray packaging

Key Features

ARM926EJ-S core up to 375 MHz for general-purpose control and application logic

C674x DSP co-processor for high-performance signal processing tasks

1 core 32-bit ARM architecture with CP15 system control

Ethernet 10 100 Mbps one port

USB 1.1 with PHY one port and USB 2.0 with PHY one port

LCD display controller no 3D graphics acceleration

SATA 3 Gbps one port

SDRAM controller for external memory

Security features including boot security and cryptography

Additional interfaces HPI I2C listed as IC McASP McBSP MMC SD SPI UART

I O voltage levels 1.8 V and 3.3 V

Surface mount BGA package with supplier device package 361-NFBGA 13 x 13 mm

Series OMAP-L1x base product number OMAPL138

RoHS3 compliant environmental status

Key Advantages

Dual-architecture design ARM plus DSP reduces system BOM and offloads compute-heavy signal processing from the main CPU

Integrated PHYs for USB simplify board design and lower component count

Broad peripheral coverage Ethernet USB LCD SATA and rich serial interfaces enable one-chip connectivity for many embedded systems

Industrial-grade temperature range improves reliability in harsh environments

Mature TI ecosystem with long-term support, toolchains, and software libraries

Compact 13 x 13 mm 361-ball BGA saves PCB area while enabling high pin-count connectivity

Built-in boot security and cryptography strengthen protection for firmware and data

Packaging

Type BGA fine-pitch NFBGA also referenced as LFBGA in some materials

Size 13 mm x 13 mm body 361 balls

Pin configuration 19 x 19 matrix typical 361 total verify exact ball map in datasheet

Material molded plastic package with organic substrate and lead-free solder balls RoHS3 compliant

Mounting surface mount compatible with standard BGA assembly profiles

Thermal characteristics junction temperature range minus 40 to 105 degrees Celsius thermal path through solder balls to PCB use adequate copper planes and thermal relief for heat spreading

Electrical properties I O rails at 1.8 V and 3.3 V observe sequencing and decoupling guidelines for core and I O rails per datasheet

Shipping package tray for secure handling during assembly

Stock status quantity available 1696 units subject to change contact us for the latest availability

Lifecycle

Current status mature catalog product in the OMAP-L1x family not publicly flagged as end of life at the time of writing always confirm latest status on our website

Recommended equivalents and alternatives within the TI portfolio

- OMAP-L138 family speed grade and revision variants for different temperature and performance bins

- OMAP-L137 similar ARM9 plus C674x DSP device with a slightly different peripheral set

- AM1808 Sitara ARM9 if DSP is not required ARM-only alternative with comparable interfaces

- AM1810 Sitara ARM9 variant depending on peripheral needs

- TMS320C6748 DSP-only solution if an external host handles control tasks

Compatibility notes pinout, peripherals, and software support vary across these options review the datasheets and migration guides carefully

If you need drop-in equivalents or second-source options contact our sales team via the Y-IC website for tailored guidance and up-to-date PCN EOL information

Key Application Areas

Industrial control and factory automation HMI PLC co-processor

Real-time audio processing professional audio mixers and codecs using McASP McBSP

Communications gateways and protocol converters Ethernet USB serial

Medical devices and instrumentation signal acquisition and processing

Motor control drives and motion systems combining control and DSP algorithms

Point-of-sale kiosks data loggers and handheld terminals with LCD display

Embedded Linux RTOS systems requiring a balance of connectivity and signal processing

Datasheet

Y-IC hosts the most authoritative datasheet for this product model on our website

We recommend downloading the datasheet directly from this page for complete electrical, mechanical, and layout guidance

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