Texas Instruments OMAPL138AZCE3

Mfr. Part

OMAPL138AZCE3

Manufacturer

Texas Instruments (formerly Luminary Micro). Y-IC is a quality distributor of Texas Instruments products, and we will provide you with the best products and services.

Detailed Description

OMAP-L1x family ARM9-based microprocessor with integrated C674x DSP coprocessor and rich peripherals. 300 MHz ARM926EJ-S core, 32-bit architecture, on-chip boot security and cryptography, LCD controller, 10/100 Ethernet MAC, dual USB with PHY, SATA 3 Gbps, and multiple serial interfaces. RoHS3 compliant. Housed in a compact 361-ball NFBGA (13 x 13 mm). Ideal for embedded control and signal processing where size, performance, and connectivity matter.

Key Features

ARM926EJ-S core at 300 MHz, 32-bit

Integrated C674x DSP coprocessor for signal processing

10/100 Ethernet MAC (1 port)

USB 1.1 + PHY (1) and USB 2.0 + PHY (1)

SATA 3 Gbps (1)

LCD display controller

SDRAM controller

Security: boot security and cryptography

Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

RoHS3 compliant

Surface-mount BGA package, 361 balls, 13 x 13 mm

Key Advantages

Dual-core architecture (ARM + DSP) blends control and high-performance signal processing

Broad interface set reduces need for external bridge components

Integrated PHYs simplify design and lower BOM cost

Mature, widely used platform with strong ecosystem and software support

Compact BGA saves PCB area while offering high pin count for connectivity

In-stock availability at Y-IC (current quantity: 2697) for fast delivery

Packaging

Type: 361-ball NFBGA, also noted as 361-LFBGA in some sources

Material: Lead-free BGA on organic substrate, RoHS3 compliant

Size: 13 x 13 mm body

Pin configuration: 361-ball grid. Refer to datasheet for full ball map and signal assignment

Mounting: Surface mount

Thermal characteristics: Junction temperature 0°C to 90°C (Tj). Use solid ground planes, thermal vias, and proper airflow or heat spreading for sustained high-load operation

Electrical properties: I/O voltage levels 1.8 V and 3.3 V. Core at 300 MHz. SDRAM controller. Integrated high-speed interfaces (USB with PHY, SATA 3 Gbps, Ethernet 10/100)

Lifecycle

Status: Mature and active in many industrial designs. Not publicly announced as nearing discontinuation at the time of writing

Recommended equivalents and alternatives:

- OMAP-L138B: Updated variant, typically pin-compatible, similar feature set

- AM1808 (Sitara): ARM9-only, many peripherals overlap; often pin-compatible with OMAP-L138 (no DSP)

- TMS320C6748: DSP-only version for designs focusing on signal processing without ARM core

- OMAP-L137 / OMAP-L132: Related family members with differing features and speeds

- AM1810: ARM9-based alternative with similar connectivity in the Sitara line

Note: Pin and software compatibility vary by exact part number and package option. Review datasheets and migration guides. If you need different speed grades, temperature ranges, or peripheral mixes, contact our sales team via the Y-IC website for the best fit and availability

Key Application Areas

Industrial control and automation

Motor control and drives

Embedded HMI with LCD

Medical devices and instrumentation

Audio processing and voice systems (McASP/McBSP)

Networked gateways and edge devices (Ethernet, USB)

Data acquisition and logging (MMC/SD, SPI, UART)

Security-enabled embedded systems (boot security, cryptography)

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading it directly from this page to ensure you have the latest and most complete technical information.

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