Texas Instruments OMAPL137CZKBD4

Mfr. Part

OMAPL137CZKBD4

Manufacturer

Texas Instruments TI formerly Luminary Micro. Y-IC is a quality distributor of TI and we will provide you with the best products and services

Detailed Description

High-integration embedded microprocessor in the OMAP-L1x family combining an ARM926EJ-S core and a C674x DSP for control plus signal processing. Runs up to 456 MHz with a 32-bit ARM core and on-chip DSP accelerators. Rich connectivity Ethernet 10 100 USB 1.1 and USB 2.0 each with integrated PHY LCD controller SDRAM controller and interfaces including HPI I2C McASP MMC SD SPI and UART. Industrial junction temperature range -40 to 90 C. RoHS3 compliant. Surface-mount in a 256-ball BGA 17 x 17 mm. Supplier device package 256-BGA. Base product OMAPL137. Supplied in trays. Current available quantity 2663 units

Key Features

ARM926EJ-S up to 456 MHz single 32-bit core with CP15 system control

Integrated C674x DSP for high-performance signal processing

10 100 Ethernet MAC

USB 1.1 with PHY and USB 2.0 with PHY

LCD controller for display driving

SDRAM memory controller

Peripherals HPI I2C McASP MMC SD SPI UART

Supplier device package 256-BGA 17 x 17 mm

Operating junction temperature -40 to 90 C

RoHS3 compliant and surface-mount

Series OMAP-L1x base product OMAPL137

Key Advantages

One chip handles real-time DSP and application control reducing components and cost

Lower power and smaller board footprint than two-chip ARM plus DSP solutions

Proven TI ecosystem tools libraries and long-term support speed development

Integrated PHYs and broad peripheral set simplify hardware design and cut BOM

Industrial temperature support for harsh environments and 24 7 operation

Packaging

Type 256-ball BGA ball grid array

Body size about 17 x 17 mm supplier device package

Ball count 256 in a dense grid for high I O connectivity

Material lead-free PBGA organic substrate epoxy mold compound RoHS3 compliant

Shipment format tray for stable handling in SMT lines

Mounting surface mount compatible with standard lead-free reflow

Pin configuration detailed ball map and signal assignments are in the datasheet

Thermal characteristics junction temperature -40 to 90 C design with adequate heat spreading and refer to datasheet for thermal resistance values

Electrical properties I O voltages 1.8 V and 3.3 V core and other rails per datasheet CPU speed up to 456 MHz integrated Ethernet 10 100 USB 1.1 and 2.0 PHY SDRAM controller LCD controller

Lifecycle

Mature product widely used in industrial and embedded systems

No official end-of-life notice known at the time of writing

Equivalent or alternative models exist depending on needs

- OMAP-L138 ARM926EJ-S plus C674x DSP similar features with variants that can be close to pin compatible

- AM18x series ARM9 only options such as AM1808 when DSP is not required shares many peripherals and software support

- TMS320C674x families C6747 C6748 DSP-only options for designs centered on signal processing

- OMAP-L132 DSP-only variant within OMAP-L1x for DSP-focused designs

Pin compatibility and peripheral mappings vary always check datasheets and hardware guides

For validated drop-in replacements lifecycle confirmations and cross-reference help contact our sales team via the Y-IC website

Key Application Areas

Industrial control PLC motor drives motion control

Pro audio mixers effects processors voice processing using C674x DSP and McASP

Human machine interfaces HMI with LCD display and touch

Networking gateways building automation smart energy devices with 10 100 Ethernet

Medical devices portable instruments patient monitoring

Printers scanners barcode and point-of-sale terminals

Test and measurement data acquisition embedded computing

Multimedia and consumer embedded systems where dedicated graphics acceleration is not needed

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for this model on our website. Download it on this page to get complete pinouts electrical limits boot modes reference schematics and layout guidance

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