Texas Instruments OMAPL137CZKB4

Mfr. Part

OMAPL137CZKB4

Manufacturer

Luminary Micro / Texas Instruments

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Detailed Description

High-integration ARM926EJ-S MPU from the OMAP-L1x family with an integrated C674x DSP co-processor for signal processing. Runs up to 456 MHz. 256-ball BGA package, 17 mm x 17 mm body, RoHS3 compliant. Includes 10/100 Ethernet MAC, USB 1.1 + PHY and USB 2.0 + PHY, LCD controller, SDRAM controller, and rich industrial interfaces. Designed for embedded microprocessor applications that need both general-purpose processing and real-time DSP.

Main Category Integrated Circuits ICs

Small Classification Embedded Microprocessors

Mounting Type Surface Mount

Operating Temperature 0°C to 90°C junction

I/O Voltages 1.8 V and 3.3 V

Supplier Device Package 256-BGA 17x17

Package Tray

Base Product Number OMAPL137

Series OMAP-L1x

Quantity in stock 2559

Key Features

ARM926EJ-S core up to 456 MHz with 32-bit bus

Integrated C674x DSP for high-performance signal processing

1x 10/100 Ethernet MAC

1x USB 1.1 with integrated PHY and 1x USB 2.0 with integrated PHY

LCD display controller

SDRAM memory controller

System control features including CP15

Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART

Graphics acceleration not included

RoHS3 compliant lead-free package

Surface-mount BGA 256-ball 17x17 mm

Key Advantages

Dual compute engines ARM + DSP for flexible workload split between control and real-time processing

Integrated PHYs for USB reduce external components and BOM cost

Broad peripheral set fits many industrial and HMI designs without extra chips

Proven TI ecosystem with tools, libraries, and long-term support

Flexible I/O at 1.8 V and 3.3 V for easy board-level interfacing

Compact 17x17 mm BGA saves PCB area for space-constrained designs

Mature platform with stable supply, ideal for long-lifecycle products

Packaging

Type 256-ball BGA, surface mount

Size 17 mm x 17 mm body

Material Lead-free, RoHS3 compliant construction per TI standards

Delivery Package Tray for automated assembly

Pin configuration 256-ball grid with dedicated balls for EMIF SDRAM, LCD, Ethernet MAC, USB, McASP, MMC/SD, SPI, UART, I2C, HPI, and power/ground per TI ball map

Thermal characteristics Junction temperature range 0°C to 90°C TJ

Electrical properties I/O at 1.8 V and 3.3 V, core and peripheral rails per TI datasheet, clock speed up to 456 MHz

Supplier device package 256-BGA 17x17

Lifecycle

Current status Generally available and widely used in the OMAP-L1x family. Not flagged for immediate discontinuation based on public information.

Recommended equivalents or alternatives

- OMAP-L138 family ARM926EJ-S + C674x DSP, similar architecture and peripherals in 256-BGA

- OMAPL138BZKB

- OMAPL138CZKB

- OMAP-L138-EP variants for extended longevity in industrial applications

- OMAP-L132 variants cost-optimized ARM926EJ-S + C674x DSP with reduced feature set

- OMAPL132CZKB

- Sitara AM18xx family ARM9-only, often pin-compatible with OMAP-L1x in select packages for ARM-only designs

- AM1808

- AM1810

- AM1806

Pinout and software compatibility can vary by exact suffix and speed grade. Check the TI datasheet and compatibility notes before substituting. If you need a drop-in replacement list for your PCB, contact Y-IC via our website and our team will verify ball maps and timing for you.

Key Application Areas

Industrial control and automation

Human-machine interfaces HMI and operator panels

Audio and voice processing with McASP and C674x DSP

Motor control and drives

Medical devices and patient monitoring

Communications gateways and protocol converters

Test and measurement instruments

Embedded Linux and RTOS platforms needing real-time DSP alongside general-purpose processing

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for OMAPL137CZKB4 on our product page. We recommend downloading the datasheet from this page to get exact ball maps, electrical specs, and design guidelines.

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