Texas Instruments OMAPL137CZKB3

Mfr. Part

OMAPL137CZKB3

Manufacturer

Luminary Micro / Texas Instruments

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Detailed Description

ARM9 + C674x DSP microprocessor from the OMAP-L1x series. 375 MHz ARM926EJ-S CPU with integrated floating-point C674x DSP for signal processing. 256-ball BGA, 17 mm x 17 mm, RoHS3 compliant. Includes 10/100 Ethernet MAC, USB 1.1 + PHY, USB 2.0 + PHY, LCD controller, SDRAM controller, and rich serial/audio interfaces. Designed for embedded control, industrial, audio, and connectivity applications.

Key Features

Core CPU: ARM926EJ-S, up to 375 MHz, 32-bit ARMv5TEJ with MMU and CP15 system control

DSP Core: C674x floating-point DSP for real-time signal processing

One core (ARM) plus dedicated DSP co-processor architecture

I/O voltages: 1.8 V and 3.3 V domains

Memory controller: SDRAM

Connectivity: 10/100 Mbps Ethernet MAC (1)

USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)

Display: LCD controller; no graphics acceleration

Interfaces: HPI, I2C, McASP (multichannel audio), MMC/SD, SPI, UART

Package: 256-BGA (17x17), surface-mount; supplier device package 256-BGA (17x17)

Operating junction temperature: 0°C to 90°C (TJ)

RoHS: ROHS3 Compliant

Series: OMAP-L1x

Base product number: OMAPL137

Speed grade: 375 MHz

Key Advantages

ARM + DSP on one chip reduces BOM, board area, and latency

Strong real-time performance for audio, motor control, and signal processing

Integrated PHYs and controllers cut external component count (USB, Ethernet, LCD)

Proven TI ecosystem, tools, and long-life support in industrial markets

Flexible I/O voltage support (1.8 V and 3.3 V) simplifies mixed-signal designs

Rich peripheral set enables direct connection to sensors, storage, displays, and audio hardware

RoHS3 compliance supports global regulatory needs

Packaging

Type: Ball Grid Array (BGA), 256 balls

Size: 17 mm x 17 mm body

Mounting: Surface mount, reflow soldering

Supplier device package: 256-BGA (17x17)

Tray packaging for production handling

Pin configuration: 256-ball grid array; see datasheet for ball map, functions, and pitch

Material: Lead-free ball alloy; RoHS3 compliant construction

Thermal characteristics: Junction temperature 0°C to 90°C (TJ); use good PCB copper area, airflow, and thermal design practices; consult datasheet for thermal resistance and power dissipation details

Electrical properties: I/O rails at 1.8 V and 3.3 V; operating frequency up to 375 MHz; refer to datasheet for core voltages, timing, and power consumption

Lifecycle

Status: Mature, widely used in industrial designs. Not announced as EOL at the time of writing. Availability subject to TI production and market demand.

Equivalent or alternative models:

- OMAP-L138 family (ARM9 + C674x DSP, similar architecture; some variants are pin-compatible; peripheral differences may apply)

- OMAP-L137 variants with different speed grades and temperature ranges (verify suffix for package/temp)

- Sitara AM1808 (ARM926EJ-S, similar ARM functionality without DSP; software differences apply)

- TMS320C6747 / C6748 (DSP-only, for designs that do not need the ARM core)

- OMAP-L132 (DSP-only, related family member)

Important: Pin, peripheral, and software compatibility vary. Review each datasheet and errata carefully. If you need help choosing the best drop-in or functional alternative, contact our sales team via the Y-IC website for detailed guidance and cross-checks.

Key Application Areas

Industrial control, factory automation, PLCs, motor control, and robotics

Audio processing, voice, beamforming, soundbars, professional audio interfaces (McASP)

Human-machine interface (HMI) panels and LCD-based displays

Medical and laboratory equipment requiring real-time DSP and connectivity

Printers, barcode scanners, point-of-sale terminals, and data loggers

Gateways, edge devices, and embedded networking with Ethernet and USB

Portable and embedded systems requiring low BOM and robust performance

Datasheet

Y-IC provides the most authoritative datasheet for OMAPL137CZKB3 on our product page. For exact pin maps, electrical specs, timing, and thermal data, download the datasheet now directly from our site for the latest, verified information.

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