APPLE 338S00046-A1

Mfr. Part

338S00046-A1

Manufacturer

APPLE

Y-IC is a quality distributor for APPLE components. We provide genuine products, fast support, and reliable logistics to help you build and maintain your designs with confidence.

Detailed Description

Proprietary Apple specialized IC in a BGA package for Apple platforms. Category: Integrated Circuits (ICs) > Specialized ICs. Package/Case: 869 (BGA case code as listed). Typical use is inside Apple devices or Apple-centric designs. Suited for high-density, space-limited assemblies. Current available quantity: 5312 units (subject to change).

Key Features

Apple custom IC for Apple device platforms

High-integration BGA for compact layouts

Fine-pitch, high-ball-count interface for dense routing

Designed for mobile and consumer electronics reliability

Lead-free, RoHS-friendly construction in most lots (verify per batch)

ESD-sensitive device; handle with proper protection

Supports automated assembly and reflow processes

Key Advantages

Small footprint saves PCB space

High integration reduces external components and BOM complexity

BGA format improves electrical performance versus long leaded packages

Built for high-volume, high-reliability production environments

Y-IC stocking and sourcing support help reduce downtime and supply risk

Packaging

Type: BGA (Ball Grid Array), case code listed as 869

Materials: Organic substrate with epoxy molding; lead-free SAC solder balls in most builds (confirm per lot)

Size: Compact BGA outline; exact body size and ball pitch per datasheet for this Mfr. Part

Pin configuration: High-ball-count grid for power, ground, and signal distribution; exact map and bank functions per datasheet

Moisture sensitivity: Typical for BGA devices (often MSL 3); confirm on product label and datasheet before reflow

Thermal characteristics: Requires good PCB thermal paths (ground planes, via arrays under the package). Follow reflow profile and thermal guidelines in the datasheet

Electrical properties: CMOS device; ESD sensitive. Operating voltages, I/O levels, and timing are device-specific and defined in the datasheet

Shipping form: Typically supplied in trays for BGAs; tape-and-reel may not be applicable. Confirm packaging format with our sales team

Storage and handling: Keep in dry pack until use, respect MSL floor life, bake if required prior to reflow

Lifecycle

Status: Proprietary Apple part; supply and lifecycle are controlled by Apple build cycles and platform demand

Nearing discontinuation: No public end-of-life notice available for this Mfr. Part

Equivalents/alternatives: No known direct drop-in equivalents due to custom Apple design and ball map. If you need a functional alternative or a different revision for repair use, contact our sales team via the Y-IC website for guidance on compatible options or cross-references

For the latest lifecycle and stocking info, please reach out to our team

Key Application Areas

Apple device manufacturing and repair

Authorized service and refurbishment centers

Spares for field maintenance and board-level rework

R&D labs evaluating Apple platform boards

High-density consumer electronics where this specific Apple IC is required

Datasheet

Y-IC provides the most authoritative datasheet and technical documentation available for this specific model on our product page. We recommend downloading the datasheet from our website now to review pin map, mechanical outline, reflow profile, and all electrical limits.

Request for Quotation Now

Ready to buy or need pricing fast? Get a Quote on our website today. Limited Time Offer on available stock. Have questions? Learn More on the product page or contact our sales team for immediate assistance.