Texas Instruments OMAPL138CZWTA3RW

Mfr. Part

OMAPL138CZWTA3RW

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

Highly integrated ARM926EJ-S based embedded processor with a C674x DSP for real-time signal processing. Runs up to 375 MHz, supports SDRAM, and includes rich peripherals: 10/100 Ethernet, USB 1.1 and 2.0 with PHY, SATA 3 Gbps, LCD controller, SPI, I2C, UART, MMC/SD, McASP, McBSP, and HPI. Designed for industrial temperature operation with secure boot and cryptography features. Part of the OMAP-L1x series. Base product number OMAPL138. RoHS3 compliant and surface-mount BGA.

Key Features

Core CPU ARM926EJ-S up to 375 MHz with CP15 system control

Integrated C674x DSP for signal processing and real-time workloads

1 core ARM 32-bit architecture with dedicated DSP co-processor

I/O voltages 1.8 V and 3.3 V

Memory interface SDRAM controller

Networking 10/100 Ethernet MAC

USB two ports total USB 1.1 + PHY and USB 2.0 + PHY

Storage SATA 3 Gbps port

Display LCD controller

Audio and industrial serials McASP, McBSP

Expansion and storage MMC/SD, SPI, UART, I2C, HPI

Security boot security and cryptography

Operating range industrial TJ -40°C to +105°C

Series OMAP-L1x family

RoHS RoHS3 compliant

Mounting surface mount BGA

Key Advantages

ARM + DSP on one chip simplifies design and reduces BOM

Strong real-time performance and deterministic control via C674x DSP

Broad peripheral set cuts the need for extra controllers and bridges

Industrial temperature range for harsh environments

Integrated PHYs for USB speed up board design and lower cost

Security features help protect firmware and IP

Proven TI ecosystem tools, libraries, and long-term supply confidence

Packaging

Type 361-ball BGA

Device package name 361-NFBGA 16 x 16 and 361-LFBGA variant naming used by TI

Body size approximately 16 mm x 16 mm per supplier device package description

Pin configuration 361-ball grid array with multiple I/O banks at 1.8 V and 3.3 V; ball map defined in the datasheet

Material lead-free BGA assembly compliant with RoHS3; standard TI organic substrate and encapsulation practices apply

Thermal characteristics junction temperature -40°C to +105°C; thermal performance depends on PCB design, copper area, airflow, and heat spreading

Electrical properties core up to 375 MHz; I/O rails 1.8 V and 3.3 V; supports SDRAM; integrated PHYs on USB; SATA 3 Gbps capability

Mounting type surface mount

Shipping package Tray

Current stock availability 2619 units as provided

Lifecycle

Status generally active within TI’s OMAP-L1x family as of the latest available information; not indicated as near end-of-life

For the most current lifecycle status and lead times, contact Y-IC sales via our website

Equivalent or alternative models

- OMAP-L138 family variants different temperature grades and package options check ball-map and features

- OMAP-L137 ARM9 + DSP with a similar peripheral set but feature differences verify SATA and USB capabilities

- OMAP-L132 value variants with reduced feature sets compare interfaces before migrating

- Sitara AM18xx series ARM9-based alternatives such as AM1808 and AM1810 similar ARM/peripheral mix but typically without the C674x DSP and may differ on SATA support

- TMS320C6748 DSP-only for applications that offload control to an external microcontroller

Note pin compatibility and peripheral presence can vary. Always confirm with the datasheet and contact Y-IC for guidance on drop-in replacements or redesign support.

Key Application Areas

Industrial control and factory automation PLCs, motion control, servo drives

Human-machine interfaces and operator panels LCD display, touchscreen control

Audio and voice processing professional audio via McASP, telematics, intercoms

Networking gateways and edge devices Ethernet, USB, storage via SATA

Medical devices patient monitoring, portable diagnostics requiring DSP

Test and measurement oscilloscopes, spectrum analyzers, data acquisition

Building and energy systems smart meters, energy controllers, HVAC

Retail and POS terminals barcode processing, transaction control

Embedded imaging and vision pre-processing on DSP with ARM system control

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. Visit our product page and download the current datasheet to get complete pin maps, electrical limits, boot options, memory timing, and layout guidelines.

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