Texas Instruments OMAPL138CZWTD4RW

Mfr. Part

OMAPL138CZWTD4RW

Manufacturer

Luminary Micro/Texas Instruments

Y-IC is a quality distributor of Texas Instruments. We focus on TI’s OMAP-L1x family and will provide you with the best products, fast delivery, and trusted technical support.

Detailed Description

High-integration embedded microprocessor from the OMAP-L1x series combining an ARM926EJ-S core (456 MHz) with a C674x DSP for signal processing. Designed for space- and power-sensitive systems that need real-time DSP plus general-purpose processing. Package is a 361-ball BGA, 16 x 16 mm. RoHS3 compliant. Mounting is surface mount. Ideal for industrial and communications equipment that requires Ethernet, USB, LCD, SATA, and robust security.

Main Category: Integrated Circuits (ICs)

Small Classification: Embedded Microprocessors

Base Product Number: OMAPL138

Quantity Available: 2517 in stock

Key Features

ARM926EJ-S core running up to 456 MHz

Integrated C674x DSP for real-time signal processing

1x 10/100 Ethernet MAC

1x USB 1.1 with integrated PHY, 1x USB 2.0 with integrated PHY

1x SATA 3 Gbps controller

LCD display controller

SDRAM memory controller

Security features: secure boot, cryptography support

System control: CP15

Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

1 core, 32-bit bus width

I/O voltages: 1.8 V and 3.3 V

Graphics acceleration: none

Series: OMAP-L1x

RoHS: ROHS3 compliant

Operating temperature (TJ): -40°C to +90°C

Key Advantages

Combines general-purpose ARM processing with high-performance DSP to cut BOM and simplify design

Rich peripheral set reduces need for external controllers

Integrated PHYs for USB simplify hardware layout and lower cost

Secure boot and crypto features help protect firmware and data

Proven TI ecosystem with tools, libraries, and long-term availability

Scalable within OMAP-L1x family for pin-compatible options

Packaging

Type: BGA, surface-mount

Package/Case: 361-ball BGA referenced as 361-NFBGA (16 x 16) and 361-LFBGA in TI materials

Body size: 16 mm x 16 mm nominal

Ball count and layout: 361-ball grid, detailed ball map in TI datasheet

Material: Molded plastic BGA with organic substrate (industry-standard BT resin)

Shipping package: Tray

Pin configuration: Mixed-signal I/O banks for Ethernet, USB, SATA, LCD, memory, and control; exact assignments per TI datasheet

Thermal characteristics: Junction temperature -40°C to +90°C; thermal performance depends on board design, airflow, and power; follow TI thermal guidelines

Electrical properties: I/O banks support 1.8 V and 3.3 V; core at ARM926/DSP operating frequencies up to 456 MHz; integrated ESD protection on I/O (levels in datasheet)

Lifecycle

Current status: Active and widely used in industrial designs

Not near discontinuation based on recent TI updates and industry use

Pin-compatible or family alternatives for risk mitigation and scalability:

- OMAP-L138 family variants (different speed and temperature grades)

- OMAP-L137 (ARM9 + C674x, similar footprint, fewer high-speed peripherals in some variants)

- OMAP-L132 (ARM9 + C674x baseline, reduced feature set)

- Sitara AM1808 (ARM9 only, similar peripheral mix, no DSP; software-simpler alternative if DSP is not needed)

- Sitara AM1810 / AM1707 (ARM9-based options with varying peripheral sets)

Note: Exact drop-in compatibility depends on suffix, speed grade, temperature grade, and feature set. For a precise cross or a verified pin-to-pin alternative, contact Y-IC sales via our website. We will confirm availability, compatibility, and migration guidance.

Key Application Areas

Industrial control, PLCs, drives, and motion control

Human–machine interfaces (HMI) with LCD panels

Audio and voice processing, active noise control, conferencing systems

Medical electronics and patient monitoring

Test and measurement instruments

Networked devices and gateways, industrial Ethernet nodes

Printers, scanners, and imaging systems

Data acquisition and logging systems

Building automation and security panels

Datasheet

Y-IC hosts the most authoritative datasheet for this product on our website. Download the datasheet on this page to get the full ball map, electrical specs, timing, thermal data, and design guidelines.

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