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| Part Number: | CY62128ELL-45ZXI |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | IC SRAM 1MBIT PARALLEL 32TSOP I |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $3.4743 |
| 10+ | $3.125 |
| 25+ | $3.0765 |
| 40+ | $3.0684 |
| 156+ | $2.7417 |
| 312+ | $2.6516 |
| 468+ | $2.6419 |
| 1092+ | $2.4601 |
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| Product Attribute | Attribute Value |
|---|---|
| Write Cycle Time - Word, Page | 45ns |
| Voltage - Supply | 4.5V ~ 5.5V |
| Technology | SRAM - Asynchronous |
| Supplier Device Package | 32-TSOP I |
| Series | MoBL® |
| Package / Case | 32-TFSOP (0.724", 18.40mm Width) |
| Package | Tray |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Memory Type | Volatile |
| Memory Size | 1Mbit |
| Memory Organization | 128K x 8 |
| Memory Interface | Parallel |
| Memory Format | SRAM |
| Base Product Number | CY62128 |
| Access Time | 45 ns |




The CY62128ELL-45ZXI from Infineon Technologies is a high-performance static random-access memory (SRAM) device designed to deliver reliable, low-power operation for a variety of applications demanding both speed and energy efficiency. Belonging to the MoBL® (More Battery Life) SRAM family, this 1Mbit (128K x 8) CMOS SRAM is optimally suited for portable and battery-powered systems, industrial controls, automotive modules, and other embedded designs. By combining a 45 ns access time with exceptionally low active and standby currents, the CY62128ELL-45ZXI supports high-speed parallel data access without compromising on energy savings, positioning itself as a competitive choice for engineers and procurement professionals seeking robust memory solutions.
The CY62128ELL-45ZXI offers a balanced feature set aligned with modern application needs. With industry-leading speed at 45 ns access time, it enables fast memory transactions vital for time-sensitive processing tasks. Power efficiency is at the fore, with typical standby current as low as 1 μA and active current typically at 1.3 mA (measured at 1 MHz), ensuring extended battery life for mobile or always-on systems. Its wide operating voltage range (4.5 V to 5.5 V) caters to systems using legacy 5V logic as well as newer designs, while compatibility with industrial (-40°C to +85°C) and automotive temperature ranges (-40°C to +125°C depending on grade) makes the device viable in harsh environments.
The CY62128ELL-45ZXI is pin-compatible with previous-generation CY62128B parts, facilitating straightforward drop-in upgrades and design reuse. Additional features such as easy memory expansion via dedicated chip enable and output enable controls, automatic power-down in standby, and robust data retention contribute to cost-effective, system-level power optimization.
Engineered for asynchronous operation, the CY62128ELL-45ZXI is organized as 128K words by 8 bits, supporting independent read and write cycles. Data access is managed through standard control signals: Chip Enable (CE), Output Enable (OE), and Write Enable (WE), with specific input combinations governing memory state transitions.
For read operations, the combination of CE active (CE1 LOW and CE2 HIGH), OE LOW, and WE HIGH exposes memory contents at the I/O pins. Write operations are invoked when CE is active and WE is LOW, allowing incoming data on I/O pins to be latched into the addressed location.
To reduce power consumption, the device automatically enters standby mode when chip enable conditions are not met, drastically lowering power draw by over 99%. During standby or when not selected, the I/O pins enter a high-impedance state, preventing bus contention and allowing for efficient system-level memory expansion.
The component is optimized for direct interface with TTL-level input/output systems and should be selected with consideration for processor logic standards in the end application.
Operation of the CY62128ELL-45ZXI is characterized by robustness and flexibility. The core supply voltage spans 4.5 V to 5.5 V, making it compatible with a broad spectrum of legacy and contemporary system voltages. The maximum ratings emphasize durability: storage temperatures from -65°C to +150°C, operating ambient temperatures up to +125°C (automotive grade), and resilience against static discharge and latch-up events.
From an electrical characteristics perspective, the CY62128ELL-45ZXI guarantees consistent performance with well-defined parameters for input and output voltages, standby and active current consumption, and data retention capabilities. Notable is the device’s ability to retain data with minimal supply current, further extending battery lifetime in designs that implement deep-sleep or data-hold modes.
Switching performance includes guaranteed address access, chip enable, and output enable times, while reliably maintaining data integrity across the specified temperature and voltage ranges.
Mechanical compatibility is a key element for system integration, and the CY62128ELL-45ZXI addresses this with versatile packaging and straightforward pinout. The device is available in industry-standard 32-pin packages, including TSOP I, SOIC, and STSOP. This packaging flexibility enables easy PCB layout, efficient use of board area, and compatibility with automated assembly processes.
Pin configuration adheres to standard SRAM conventions, with 17 address lines (A0–A16), 8 bidirectional I/O pins (I/O0–I/O7), and dedicated control signals for chip enable, write enable, and output enable. Unused pins are designated as no-connect (NC) for PCB design simplicity and layout optimization.
In real-world engineering contexts, the CY62128ELL-45ZXI shines in applications where fast, deterministic access to small or moderate blocks of memory is paramount—such as CPU workspace, data buffering, program state retention, and critical parameter storage in embedded systems. Its ultra-low-power design makes it an excellent candidate for mobile devices, handheld meters, wireless sensors, and automotive electronics where power budgets are tightly constrained.
A further advantage is in systems requiring rapid wake/sleep cycling and reliable data retention without the refresh overhead of DRAM. Design considerations include careful attention to logic level compatibility (especially when interfacing with processors expecting CMOS instead of TTL levels), signal integrity on high-speed lines, and adherence to the recommended power sequencing and timing requirements as outlined in the device’s switching specifications. Selecting the optimal package variant also depends on target application constraints such as environmental temperature, footprint, and assembly methodology.
Selecting an alternative or second-source equivalent to the CY62128ELL-45ZXI hinges on matching both electrical and functional characteristics. The most direct alternatives are Infineon’s own CY62128B series, given the device’s stated pin compatibility and functional overlap. However, engineers should consider key performance differentiators such as standby and active current, access time, and package options before making substitutions.
In cases where system logic differs (e.g., CMOS-compatible versus TTL-compatible input levels), consultation of Infineon’s recommended application notes and consideration of other MoBL or equivalent SRAM families—possibly from other major vendors—may be warranted. Always verify timing, voltage, and temperature specifications, as minor differences can impact long-term reliability or performance in end applications.
The Infineon Technologies CY62128ELL-45ZXI stands out in the SRAM landscape by combining fast access times, extensive power-saving features, and broad packaging and temperature options. Its fit for high-reliability, low-power, and high-speed applications makes it an attractive choice for engineers designing next-generation embedded systems. Careful evaluation of its characteristics—alongside equivalents and alternatives—ensures robust, future-proof memory subsystem design optimized for system performance and longevity.
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