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| Part Number: | S25FL256LDPBHI030 |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | IC FLASH 256MBIT SPI/QUAD 24BGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.3506 |
| 200+ | $0.1357 |
| 500+ | $0.1309 |
| 1000+ | $0.1286 |
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| Product Attribute | Attribute Value |
|---|---|
| Write Cycle Time - Word, Page | - |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NOR |
| Supplier Device Package | 24-BGA (6x8) |
| Series | FL-L |
| Package / Case | 24-TBGA |
| Package | Tray |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Memory Type | Non-Volatile |
| Memory Size | 256Mbit |
| Memory Organization | 32M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Memory Format | FLASH |
| Clock Frequency | 66 MHz |
| Base Product Number | S25FL256 |




The S25FL256LDPBHI030 from Infineon Technologies is a 256 Mbit (32 MB) NOR Flash device optimized for performance, flexibility, and reliability. Featuring a high-speed Serial Peripheral Interface (SPI) with support for expanded multi-I/O modes—up to Quad I/O and Quad Peripheral Interface (QPI)—the S25FL256LDPBHI030 is well suited for demanding embedded, industrial, and automotive applications. Its small-footprint BGA-24 (6 x 8 mm) packaging and advanced protection mechanisms make it a fit for space-constrained, safety-critical, and high-performance designs.
The S25FL256LDPBHI030 is part of Infineon's FL-L family, which leverages 65 nm floating gate technology to deliver strong reliability, lower power, and higher densities while maintaining compatibility with earlier generations (FL-S, FL1-K, FL-P). Its command set and physical footprint are carefully curated to enable straightforward migration from legacy devices, simplifying redesign efforts in existing platforms. By integrating high-density Flash storage with expanded SPI capabilities, the device allows pin-count reduction and reduced PCB complexity compared to parallel interface memory.
The S25FL256LDPBHI030 operates from a single 2.7V to 3.6V supply, using robust CMOS I/O for minimal power consumption and system noise. It supports both 24-bit and 32-bit addressing, accommodating main Flash memory arrays up to 256 Mbit and facilitating seamless access to extended memory spaces. The main array is organized into uniform sectors (4 KB), half blocks (32 KB), or blocks (64 KB), with granular erase and protection options.
The page program buffer allows up to 256 bytes to be programmed in a single operation. The device supports minimum 100,000 program/erase cycles per sector and 20-year data retention, addressing the needs of long-lifecycle products.
Key to the S25FL256LDPBHI030 is its SPI interface, which operates in traditional single, dual, or quad configurations and supports both SDR (up to 133 MHz) and DDR (up to 66 MHz) read rates. With the Quad I/O and QPI modes, all I/O, address, and command transfers can take place on four parallel data lines, supporting higher throughput and “execute-in-place” (XIP) designs. The interface logic allows smooth migration between legacy (single I/O) and high-performance (multi-I/O) operation, with flexible clock polarity/phase settings (SPI modes 0 and 3). For highest system compatibility, the S25FL256LDPBHI030 supports JEDEC-standard Serial Flash Discoverable Parameters (SFDP), unique device identifiers, and status registers accessible via common SPI or QPI read sequences.
The S25FL256LDPBHI030 command set is extensive, offering legacy SPI as well as advanced multi-bit protocols. It includes page and block programming, multi-level erase, suspend/resume functionality, and individual or global block (sector) locking. The device can execute random and sequential burst reads with configurable latency (dummy) cycles, optimizing system bus utilization and controller compatibility. Specialized commands support management of configuration and status registers for both volatile and non-volatile bits, enabling runtime or permanent changes to protection and system behavior. Additional feature highlights:
Page programming up to 256 bytes
Sector (4 KB), half-block (32 KB), block (64 KB), and chip erase options
Suspend/resume for program and erase tasks
Embedded algorithm reporting, including write-in-progress, program/erase errors, and operation suspend status
Security and data integrity are major strengths of the S25FL256LDPBHI030:
Redundant, individually lockable 256-byte security regions (1 KB total), supporting one-time-programmable (OTP), password-based, or hardware lockdown
Flexible array protection schemes: legacy block protection, individual block lock (IBL), and pointer region protection for true sector-level granularity
Multiple register types, with volatile, non-volatile, and OTP protection for configuration and security status
Protection enabling and disabling via status register bits, hardware write-protect pins, and password-based unlocking
Deep Power Down (DPD) mode to resist inadvertent programming or erasure
Configurable reset options (via RESET# pin or IO3/RESET# multiplexed signal) for robust recovery from brownout or system reset scenarios.
All these features combine to facilitate secure firmware storage, code signing, or system authentication and anti-cloning strategies in high-reliability environments such as automotive ECUs, industrial controllers, and IoT gateways.
The S25FL256LDPBHI030 is presented in multiple package options to suit space and mounting needs, with full RoHS compliance:
24-ball BGA (6 x 8 mm) for high-density embedded applications (the highlighted part)
Other FL-L family members available in SOIC, WSON (5x6 mm, 6x8 mm), and automotive FBGA formats
It is qualified up to:
-40°C to +85°C for industrial
-40°C to +105°C for extended industrial
-40°C to +125°C for automotive (AEC-Q100 Grade 1), ensuring coverage for harsh environment deployment.
Given its multi-protocol SPI interface, robust protection, and extended feature set, the S25FL256LDPBHI030 targets embedded applications where firmware needs to be reprogrammable and highly available—examples include automotive control units, industrial HMIs, networking hardware, PLCs, and emerging AI edge nodes. The device’s support for execute-in-place (XIP), burst reads with latency adjustment, and deep power down mode makes it particularly attractive for MCUs/SoCs requiring fast firmware booting and minimal standby current.
System designers should take care to:
Select appropriate protection modes and set OTP bits during system provisioning to avoid accidental lockout
Choose a package and temperature grade in line with the final product’s environment
Implement proper power-up, power-down, and reset handling per datasheet to maintain data integrity and consistent startup
For engineers seeking variation in density or pinout, or for second-sourcing purposes:
128 Mb (16 MB) S25FL128L family (for reduced memory requirement)
Previous generation Infineon SPI NOR Flash families: S25FL-A, S25FL1-K, S25FL-P, S25FL-S, and S25FS-S (note migration differences, as the S25FL256LDPBHI030 provides extended addressing and more advanced protection)
For applications requiring pin-for-pin or command compatibility, Infineon's documentation details direct migration paths within the FL-L family.
The Infineon S25FL256LDPBHI030 stands out as a flexible, high-performance Serial NOR Flash solution, providing significant advances in memory density, interface configuration, security, and reliability for embedded and automotive designs. With cross-compatibility to previous generations, advanced multi-I/O SPI support, and a broad protection toolkit, it forms a robust platform for firmware storage in modern electronic systems. For engineers and procurement teams, the S25FL256LDPBHI030 should be considered both for new designs and as a drop-in upgrade path for legacy systems requiring enhanced performance, security, or temperature endurance.
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