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| Part Number: | S25FL256LDPBHI020 |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | IC FLASH 256MBIT SPI/QUAD 24BGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 3380+ | $4.6554 |
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| Product Attribute | Attribute Value |
|---|---|
| Write Cycle Time - Word, Page | - |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NOR |
| Supplier Device Package | 24-BGA (8x6) |
| Series | FL-L |
| Package / Case | 24-TBGA |
| Package | Tray |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Memory Type | Non-Volatile |
| Memory Size | 256Mbit |
| Memory Organization | 32M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Memory Format | FLASH |
| Clock Frequency | 66 MHz |
| Base Product Number | S25FL256 |




The S25FL256LDPBH020 from Cypress Semiconductor Corp belongs to the FL-L family of high-density, NOR-type flash memory devices optimized for embedded and mobile applications. Featuring 256Mbit (32MB) of storage and fabricated on a 65nm floating-gate process, the device utilizes a Serial Peripheral Interface (SPI) with support for multiple I/O configurations: Single, Dual, and Quad modes, as well as a Quad Peripheral Interface (QPI). The S25FL256LDPBH020 is specifically designed to meet the increasing demands for performance, reliability, and space efficiency in applications such as boot code storage, direct code execution (XIP), firmware update repositories, and secure data storage.
Key features include SPI command compatibility across several generations (S25FL-A, S25FL1-K, S25FL-P, S25FL-S, S25FS-S), a page programming buffer supporting up to 256 bytes per operation, and industrial, industrial-plus, and automotive grade temperature support (up to AEC-Q100 Grade 1, -40°C to +125°C). The device is offered in JEDEC-standard Pb-free BGA (24-ball), SOIC, and WSON packages, targeting dense board layouts in automotive, industrial controls, communications, and consumer markets.
The S25FL256LDPBH020 supports a range of package options to accommodate diverse system requirements:
24-ball BGA (6 × 8 mm or 5 × 5 mm footprints), suitable for high-density and low-profile applications.
16-pin SOIC (300 mil), for conventional PCB layouts.
WSON (6 × 8 mm), compatible with high thermal/electrical performance boards.
Ball/pin assignments are designed to maximize compatibility with both legacy and current footprint requirements. For the BGA packages, careful consideration is given to top-view, ball-matrix alignment and interconnection (e.g., 5 × 5 or 4 × 6 matrices), ensuring that multiple package options can share a common PCB footprint. All devices integrate RESET# input options with internal pull-ups to facilitate reliable system integration and robust system-level startup recovery. Special handling instructions, such as recommended avoidance of ultrasonic cleaning for BGA parts and maximum exposure temperature limits, are provided to mitigate long-term reliability risks during assembly.
The S25FL256LDPBH020 employs an advanced SPI multi-I/O protocol architecture:
Traditional SPI (single I/O, 1-bit serial).
Dual I/O (2-bit wide).
Quad I/O (4-bit wide, or QPI mode where all communication occurs over four wires).
This flexible approach slashes interconnect pin count compared to parallel-nor flash, reducing both package size and power consumption. Supported SPI clock modes include Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). The device supports both Single Data Rate (SDR, up to 133MHz) and Double Data Rate (DDR, up to 66MHz) operation, improving bandwidth for read-intensive and XIP use cases. Instruction, address, and data phases can be independently set for single, dual, or quad width depending on performance needs. Crucially, QPI mode brings all phases to a 4-bit I/O bus, enabling significant throughput in conjunction with DDR commands.
Data transfer reliability is enhanced through configurable read latency (dummy cycles), programmable drive strength for output buffers, and a continuous read feature that minimizes command overhead for sequential memory accesses – an advantage for cache line fills and direct execution scenarios.
The S25FL256LDPBH020 organizes its 256Mbit memory array into uniform 4KB sectors, 32KB half blocks, and 64KB blocks, supporting both granular and large-scale erase operations. The main flash array is directly addressable using either 24- or 32-bit addressing, with the latter allowing full access to the higher-density device space, and legacy 24-bit for backward compatibility. The device features a page programming buffer capable of handling up to 256 bytes in a single transaction, improving throughput and write efficiency.
In addition to the main flash array, several special address spaces are provided:
Unique device ID space (64-bit, factory-programmed per device).
JEDEC-compliant Serial Flash Discoverable Parameters (SFDP), allowing host discovery of configuration and command sets.
Security Regions, totaling 1024 bytes and divided into four individually lockable 256-byte regions, for one-time-programmable or password-protected storage.
Register maps (status, configuration, protection) accessible via dedicated command sequences.
Addressing system integrity, the S25FL256LDPBH020 implements a comprehensive suite of security features:
Legacy block protection (top/bottom, partial/full array, controlled by BP and TBPROT bits).
Individual block lock (IBL) with one volatile bit per sector/block, supporting real-time flexible protection and unprotection, including global lock/unlock options.
Pointer Region Protection (PRP), permitting one sector to act as the boundary between writable and protected regions, with OTP-level locking.
Four Security Regions (256 bytes each) with permanent or password-based locking.
Status and configuration registers with volatile, non-volatile, and one-time-programmable (OTP) bits, providing layered protection strategies.
SRP0/SRP1 bits, governing whether register and array protection is driven purely in software, with WP# pin hardware input, or through power supply lock-down.
Deep Power Down (DPD) mode, which places the memory in a state requiring explicit wakeup/resume, further minimizing risk of inadvertent write or erase.
Password protection mechanisms allow configuration where Security Regions and Pointer Region Protection can only be modified—sometimes even read—when a user-defined password is presented. Permanent protection and lock-down status are also supported, enabling compliance with stringent firmware update and secure boot requirements.
The S25FL256LDPBH020 is engineered for high reliability and robust endurance:
Maximum read speed: up to 133MHz SDR or 66MHz DDR in quad I/O mode.
Typical program time: page-level programming typically consumes sub-millisecond times per 256-byte page, with internal buffering for optimal efficiency.
Erase architecture supports fastest cycle times:
- Sector erase (4KB)
- Half-block erase (32KB)
- Block erase (64KB)
- Full chip erase
Guaranteed endurance of at least 100,000 program/erase cycles per sector enables extended life in code and data applications, while data retention is rated at a minimum of 20 years at room temperature.
Automotive-grade options certified to AEC-Q100 up to Grade 1 (-40°C to +125°C).
All registers impacting operation and protection can be written in parallel with data programming, supporting rapid mode switching for secure field updates and system boot.
Designed for low voltage operation and robust performance across industrial and automotive ranges, the S25FL256LDPBH020 has the following characteristics:
Supply voltage: 2.7V to 3.6V, single supply.
Typical standby current in CMOS standby mode to minimize battery drain.
Deep power-down mode drops standby current further for energy-critical applications.
Performance maintained across industrial (-40°C to +85°C), industrial plus (-40°C to +105°C), and full automotive AEC-Q100 Grade 1 (-40°C to +125°C) temperature ranges.
ESD, latch-up, and thermal characteristics comply with JEDEC and automotive standards.
Considerations are provided for signal overshoot during transitions, decoupling requirements, and RESET#/IO3 reset handling to ensure power-on/off integrity and noise immunity.
The S25FL256LDPBH020 provides a rich set of software-accessible commands, following the SPI NOR flash industry’s conventions while adding advanced features for flexibility:
Hierarchical register model with both volatile and non-volatile versions, supporting dynamic and persistent configuration changes.
Extensive command set for reading and writing status, configuration, individual/block protection, password, and data learning registers.
Adherence to JEDEC SFDP standard, supporting automatic host discovery of functional and timing capabilities.
Dynamic adjustment of output drive strength, address width (3 or 4 bytes), protection mechanism selection, and read latency through register writes.
Reset and suspend/resume commands for robust firmware upgrade, in-system debugging, and field update support.
Engineers evaluating the S25FL256LDPBH020 can consider several alternatives or direct replacements within Cypress's and Infineon’s SPI NOR flash portfolio, including:
S25FL128L: Half the density (128Mbit), available with otherwise similar features, pinout, and command compatibility.
S25FL-L family devices: Pin-to-pin and command compatible devices with differing densities or temperature/automotive grades.
S25FL1-K, S25FL-A, S25FL-P, S25FL-S, S25FS-S: Supported by legacy SPI command compatibility, with varying levels of interface, density, and packaging.
Nearly all S25FL256L and S25FL-L family devices offer seamless migration pathways via register settings controlling address width, footprint, and protection modes, minimizing hardware and software changes during design transitions or end-of-life events.
The S25FL256LDPBH020 stands out as a highly integrated, flexible, and reliable 256Mbit SPI NOR flash memory device. Its advanced command and register architecture allow for dynamic configuration and robust data integrity, well-suited for demanding embedded, industrial, and automotive environments. With comprehensive protection mechanisms, support for XIP, and migration compatibility with both legacy and next-generation SPI flash families, the S25FL256LDPBH020 offers a solid foundation for secure, high-performance code and data storage applications. Selection engineers and sourcing teams can confidently specify this series knowing it will serve in mission-critical, long-lifecycle, and harsh environment designs.
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