Infineon Technologies S25FL256LDPBHN030

Mfr. Part

S25FL256LDPBHN030

Manufacturer

Cypress Semiconductor now part of Infineon Technologies. Y-IC is a quality distributor of this brand and we will provide you with the best products and services

Detailed Description

256 Mbit NOR Flash for embedded systems. Serial interface SPI with Quad I O and QPI modes. Supply voltage 2.7 to 3.6 V. Up to 66 MHz serial clock. Industrial temperature range minus 40 to plus 125 C TA. Surface mount 24 ball BGA package about 6 x 8 mm. RoHS3 compliant. Base product number S25FL256. Series FL L. Main category Integrated Circuits ICs. Classification Memory. Supplier device package 24 BGA 6 x 8. Standard shipment packaging Tray

Key Features

256 Mbit density with 32M x 8 organization

SPI interface with Quad I O and QPI for higher data rate

2.7 to 3.6 V single supply operation

Up to 66 MHz serial clock rate

Wide operating temperature minus 40 C to 125 C TA

Surface mount package 24 ball BGA approximately 6 x 8 mm body

RoHS3 compliant and lead free construction

FL L series with S25FL256 base platform

Designed for reliable code storage and fast random read typical of NOR Flash

Key Advantages

Fast read performance and responsive boot behavior

Simple design in on standard SPI bus with low pin count

Quad I O and QPI modes increase throughput for firmware updates and data logging

Wide temperature range supports harsh environments

Mature NOR technology with strong data retention and endurance

Compact BGA footprint saves PCB space and supports high density layouts

Packaging

Type surface mount 24 ball BGA. 24 TBGA variant also referenced for this family

Material lead free and RoHS3 compliant molded package

Size body about 6 mm x 8 mm compact footprint

Pin configuration 24 balls. Typical signals include Chip Select CS, Serial Clock SCK, Data IO0 to IO3, Power VCC, Ground GND, Write Protect WP, Reset or Hold. Some balls may be No Connect. See the datasheet for the exact ball map and naming

Thermal characteristics wide operating temperature minus 40 C to plus 125 C TA. Use good PCB copper area and layout for heat spreading and reliability

Electrical properties supply 2.7 to 3.6 V, serial clock up to 66 MHz, SPI Quad I O and QPI interfaces, memory organization 32M x 8

Shipment packaging Tray for stable handling in volume production

Lifecycle

Status active production based on recent public information for the FL L series

Not considered near discontinuation at this time

Equivalent and alternative models list

- Infineon S25FL256L family other part numbers with different speed, package, and temperature grades such as S25FL256LQP variants and S25FL256LPB variants

- Micron MT25QL256 series 256 Mbit SPI NOR 3 V class

- Winbond W25Q256JV and W25Q256JW series 256 Mbit SPI NOR

- Macronix MX25L25635F and MX25L25645G series 256 Mbit SPI NOR

- ISSI IS25LP256D and IS25WP256D 256 Mbit SPI NOR

- GigaDevice GD25Q256 256 Mbit SPI NOR

Compatibility notes command set, timing, and ball map can differ by vendor. Always check datasheets and validate in your system. If you need help selecting an alternative, contact our sales team on the Y-IC website

Key Application Areas

Boot flash for MCUs, SoCs, FPGAs, and DSPs

Firmware storage for industrial control and automation

Rugged IoT and edge devices that need wide temperature support

Networking and telecom equipment including routers, gateways, and modems

Consumer electronics such as smart home controllers and set top boxes

Medical and instrumentation devices requiring reliable nonvolatile memory

Automotive subsystems where wide temperature is required. Check datasheet for specific qualifications

Datasheet

Y-IC provides the most authoritative datasheet for S25FL256LDPBHN030 on our product page. Download it here to get full specifications, timing, command set, and the exact ball map

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