Infineon Technologies S25FL256LDPBHN020

Mfr. Part

S25FL256LDPBHN020

Manufacturer

Cypress Semiconductor (Infineon Technologies)

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Detailed Description

256Mbit (32M x 8) serial NOR Flash memory for code and data storage. 3.0V supply (2.7V to 3.6V). SPI with Quad I/O and QPI modes for faster reads. Compact 24-ball TBGA/BGA package (8 mm x 6 mm). Industrial/harsh-environment ready with -40°C to +125°C operating range. RoHS3 compliant. Ideal for boot code, firmware, and configuration storage where reliability and random read access are critical.

Key Features

Capacity: 256Mbit (32M x 8)

Interface: SPI, Quad I/O, QPI mode

Max clock: 66 MHz

Technology: NOR Flash (non-volatile)

Voltage: 2.7V to 3.6V

Temperature: -40°C to +125°C (TA)

Package: 24-BGA / 24-TBGA, 8x6 mm body

Series: FL-L

Memory format: FLASH; Base product: S25FL256

RoHS: RoHS3 compliant, lead-free

Mounting: Surface mount

Typical SPI signals: CS#, SCK, IO0–IO3, WP#, HOLD#, VCC, GND

Deep power-down and standby modes

Security features: Unique ID and OTP area (for serialization and calibration)

Uniform sector architecture with small sub-sectors for flexible updates

Supports execute-in-place (XiP) via fast read modes

Key Advantages

Fast random reads and low-latency code execution typical of NOR

Quad I/O and QPI increase throughput without more pins

Wide temperature range suited for industrial and automotive environments

High endurance and robust data retention for long product life

Small footprint TBGA saves PCB space and improves routing

Proven FL-L family with broad ecosystem and software support

Low pin count simplifies board design and reduces BOM cost

Packaging

Type: 24-ball TBGA/BGA, surface mount

Body size: 8 mm x 6 mm, low profile

Material: Molded epoxy package with lead-free solder balls

Ball configuration: 24-ball grid optimized for SPI/QSPI signals, power, and ground

Pinout highlights: CS#, SCK, IO0–IO3 (DQ0–DQ3), WP#, HOLD#/RESET#, VCC, multiple GND balls for integrity

Thermal characteristics: Designed for reliable operation from -40°C to +125°C; BGA format aids heat spreading; refer to datasheet for ThetaJA and board-dependent values

Electrical properties: 2.7V–3.6V supply, 66 MHz clock rating, CMOS/TTL-compatible I/O; low active current, ultra-low standby/deep power-down

Supplier device package: 24-BGA (8x6)

Factory packing: Tray

Lifecycle

Status: Active in the Infineon/Cypress FL-L family; not near end-of-life based on current public information

Close equivalents and alternatives (3V, 256Mbit, QSPI/SPI NOR):

- Infineon/Cypress S25FL256S family (similar density with enhanced performance options)

- Micron MT25QL256 series (e.g., MT25QL256ABA)

- Winbond W25Q256JV series

- Macronix MX25L25645G / MX25U256 series (U for low-voltage variants; verify supply)

- ISSI IS25LP256 (3V) / IS25WP256 (Dual supply options; verify)

- Adesto/Dialog AT25QL256

If you need pin-to-pin or software-compatible replacements, or automotive-grade variants, contact Y-IC via our website for detailed cross-reference and availability

Key Application Areas

MCU/MPU boot code and firmware storage

Industrial control, PLCs, motor drives, HMIs

Automotive modules and harsh-environment systems (wide temp support)

Networking and communications equipment

IoT gateways, smart home, and edge devices

Consumer electronics needing fast code execution from external Flash

Storage of configuration data, parameters, logs, and calibration tables

Datasheet

Y-IC hosts the most authoritative, up-to-date datasheet for S25FL256LDPBHN020 on our product page. We recommend downloading it here for complete electrical, timing, and mechanical specifications.

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