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| Part Number: | S25FL256LDPBHN023 |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | IC FLASH 256MBIT SPI/QUAD 24BGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 2500+ | $5.1126 |
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| Product Attribute | Attribute Value |
|---|---|
| Write Cycle Time - Word, Page | - |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NOR |
| Supplier Device Package | 24-BGA (8x6) |
| Series | FL-L |
| Package / Case | 24-TBGA |
| Package | Tape & Reel (TR) |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Memory Type | Non-Volatile |
| Memory Size | 256Mbit |
| Memory Organization | 32M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Memory Format | FLASH |
| Clock Frequency | 66 MHz |
| Base Product Number | S25FL256 |




S25FL256LDPBHN023
Cypress Semiconductor (Infineon Technologies). Y-IC is a trusted quality distributor of Infineon/Cypress products and we are committed to delivering genuine parts, fast service, and the best overall buying experience.
256 Mbit (32 MB) NOR Flash memory optimized for code storage and execute-in-place. Operates from a single 2.7 to 3.6 V supply. Quad-SPI and QPI supported for higher throughput. Supplied in a compact 24-ball BGA package for space-constrained designs and high-reliability surface-mount assembly. Part of the FL-L family for long-term availability and stable feature set.
Density 256 Mbit with 32M x 8 organization
Interface SPI with Quad I/O and QPI modes for faster read
Clock up to 66 MHz as specified for this ordering code
3.0 V class supply range 2.7 to 3.6 V
Uniform sector architecture with small 4 KB sectors and standard 64 KB blocks (verify exact layout in datasheet)
4-byte addressing support for >16 MB addressing
Standard SPI flash command set plus SFDP (JESD216) for automatic parameter discovery
Security features including block protection, one-time programmable (OTP) area, and unique ID (see datasheet for size and options)
Program/erase suspend and resume, deep power-down mode
Industrial and extended temperature support from -40°C to +125°C (TA)
RoHS3 compliant and lead-free
Reliable code storage and XIP performance typical of NOR technology
Simple migration within the FL-L family and across densities using standard SPI flash protocols
Quad I/O and QPI reduce boot times and improve throughput without changing the basic SPI footprint
Wide temperature range suits harsh environments
Mature ecosystem support across MCUs, SoCs, and bootloaders
Delivery format Tape and Reel for automated pick-and-place
Package type 24-ball Thin BGA (24-TBGA), supplier device package 24-BGA (8 x 6 mm body)
Body size approximately 8 mm x 6 mm; low-profile mold compound over laminate substrate
Termination lead-free, RoHS3 compliant balls
Ball/pin configuration 24-ball array with standard Quad-SPI pinout: CS#, SCK, IO0/SI, IO1/SO, IO2/WP#, IO3/HOLD#, VCC, multiple VSS, and NC/RFU or optional control pins per Cypress/Infineon pin map (see package drawing for exact ball map)
Thermal characteristics rated for -40°C to +125°C ambient operation; actual thermal resistance depends on PCB and airflow (refer to datasheet for θJA/θJC and reflow profile)
Electrical properties core parameters include 2.7–3.6 V VCC, up to 66 MHz SPI clock for this device code, fast read/program/erase timings, low standby current (see datasheet tables for limits)
Status Active and in production under Infineon Technologies
Not nearing discontinuation to the best of current public knowledge
Equivalent or alternative models (form/fit/function close candidates, verify pinout, timing, and software before substitution):
- Infineon/Cypress S25FL256S series (legacy predecessor in compatible footprints for some packages)
- Infineon/Cypress S25FL128L and S25FL512L (same family lower/higher density options)
- Micron MT25QL256 series (VFBGA 24, Quad-SPI/QPI)
- Winbond W25Q256JV series (TFBGA-24 Quad-SPI)
- Macronix MX25L25645G series (TFBGA-24 Quad-SPI)
- ISSI IS25LP256D series (TFBGA-24 Quad-SPI)
- GigaDevice GD25Q256 series (check BGA option and mapping)
If you need exact pin-to-pin and software compatibility guidance, please contact our sales team through the Y-IC website for detailed cross-references and engineering support.
MCU and SoC boot code storage with XIP
Industrial control, PLCs, HMI, motor drives
Networking and telecom equipment boot flash
Consumer electronics and smart home devices
IoT gateways and edge nodes
FPGA/SoC configuration storage
Medical and test equipment data/code storage
Automotive infotainment and cluster code storage where temperature range fits system qualification (verify AEC requirements per project)
Y-IC hosts the most authoritative and up-to-date datasheet and technical collateral for this product model. We recommend downloading the datasheet directly from this page on our website to get exact electrical limits, timing, command set, package drawings, and thermal data.
In stock and ready to quote. Recommended action: Get a Quote now on Y-IC to secure pricing and allocation. Click Get a Quote or Learn More on this page. Limited Time Offer pricing may be available for volume buys—act now to lock in the best deal.
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S25FL256LDPBHN023Infineon Technologies |
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