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| Part Number: | XC2VP50-7FF1152C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 692 I/O 1152FCBGA |
| Datasheets: |
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| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.425V ~ 1.575V |
| Total RAM Bits | 4276224 |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Series | Virtex®-II Pro |
| Package / Case | 1152-BBGA, FCBGA |
| Package | Bulk |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 53136 |
| Number of LABs/CLBs | 5904 |
| Number of I/O | 692 |
| Mounting Type | Surface Mount |




XC2VP50-7FF1152C
AMD Xilinx — Y-IC is a trusted, quality distributor of AMD Xilinx. We’ll deliver the best products and services, backed by expert support and fast logistics.
High-performance Virtex-II Pro FPGA with 53,136 logic cells, 5,904 LABs/CLBs, 4,276,224 total RAM bits, and 692 user I/O. Package is 1152-FCBGA (35x35), speed grade -7, commercial temp range. Core supply 1.425–1.575 V. Surface-mount BGA for dense, high-speed designs. RoHS non-compliant legacy device. In-stock quantity: 2661 for quick shipment.
Family: Virtex-II Pro
Speed grade: -7 (high performance within family)
Logic capacity: 53,136 logic elements/cells
CLBs/LABs: 5,904
On-chip memory: 4,276,224 total RAM bits
I/O count: 692 user I/O
Package: 1152-FCBGA (35x35), Supplier Device Package 1152-FCBGA (35x35)
Case options seen: 1152-FCBGA, 1152-BBGA/FCBGA
Mounting: Surface Mount (BGA)
Operating temperature: 0°C to 85°C (TJ), commercial grade
Core voltage: 1.425 V to 1.575 V
Configuration: JTAG and standard Xilinx configuration modes (family-supported)
Toolchain: Xilinx ISE (legacy), device supported by established flows
High I/O density for wide external connectivity and parallel interfaces
Robust on-chip RAM for buffering, packet processing, and frame storage
Mature, proven silicon with broad ecosystem and reference designs
Stable performance in demanding digital logic and DSP workloads
BGA package provides compact footprint and good electrical integrity
Available stock for immediate needs on legacy refresh and maintenance programs
Type: Bulk shipment for manufacturing use
Package/Case: 1152-FCBGA (35x35 mm body size)
Material: Flip-Chip Ball Grid Array; organic substrate with solder balls (legacy, non-RoHS)
Pin configuration: 1152 balls total; 692 user I/O available; dedicated configuration and JTAG pins; multiple I/O banks
Mounting: Surface Mount; requires professional BGA reflow
Thermal characteristics: Junction temperature 0°C to 85°C (TJ); BGA aids heat spreading; use proper PCB copper, airflow, and heatsink if needed for high utilization
Electrical properties:
- Core supply (VCCINT): 1.425–1.575 V
- I/O banks support common standards of the era (e.g., LVCMOS, LVDS, SSTL, HSTL — see datasheet for bank-specific voltages and limits)
- Power sequencing and decoupling per Virtex-II Pro guidelines
Status: Legacy/mature generation; many Virtex-II Pro devices are near or at end-of-life. Non-RoHS status further indicates older production era.
Availability: We currently have inventory (2661 units). For long-term supply, plan migration.
Equivalents/Alternatives (not pin-compatible; selection depends on logic, I/O, transceivers, and power targets):
- Virtex-5: XC5VLX50, XC5VLX85 (newer architecture, similar logic ranges)
- Virtex-6: XC6VLX75T, XC6VLX130T (enhanced performance, lower power vs. Virtex-II Pro)
- Kintex-7: XC7K70T, XC7K160T (good balance of performance, power, and cost)
- Artix-7: XC7A100T (cost-effective if transceivers and very high I/O are not required)
- Virtex-7: XC7VX1140T (for extremely high logic and I/O needs)
- UltraScale/UltraScale+: XCKU040, XCVU3P (modern high-performance replacements)
Exact cross depends on features like embedded processors, multi-gigabit transceivers, I/O standards, and memory needs. If you need a tailored migration path or closest match, contact our sales team via the Y-IC website for expert guidance.
Telecom and networking infrastructure (packet processing, switching, protocol bridging)
Test and measurement (high-channel count digital capture and pattern generation)
Industrial and medical imaging (data pipelines, memory buffering, custom interfaces)
Defense and aerospace legacy platforms (upgrade and maintenance spares)
High-speed data acquisition and signal processing (DSP pipelines, filtering, FFT)
Embedded control and custom coprocessing (soft processors or family-supported hard cores)
Y-IC hosts the most authoritative datasheet for XC2VP50-7FF1152C on our product page. We recommend downloading it now for exact electrical limits, I/O bank rules, configuration modes, and design guidelines.
Act now — Get a Quote on Y-IC to secure current inventory. Learn More about specifications and alternatives on the product page. Limited Time Offer: lock in pricing and availability today.
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